Transistor count
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.
Records
, the highest transistor count in flash memory is Micron's 2terabyte 16-die, 232-layer V-NAND flash memory chip, with 5.3trillion floating-gate MOSFETs.The highest transistor count in a single chip processor as of 2020 is that of the deep learning processor Wafer Scale Engine 2 by Cerebras. It has 2.6trillion MOSFETs in 84 exposed fields on a wafer, manufactured using TSMC's 7 nm FinFET process.
, the GPU with the highest transistor count is Nvidia's Blackwell-based B100 accelerator, built on TSMC's custom 4NP process node and totaling 208 billion MOSFETs.
The highest transistor count in a consumer microprocessor as of 2025 is 184billion transistors, in Apple's ARM-based dual-die M3 Ultra SoC, which is fabricated using TSMC's 3 nm semiconductor manufacturing process.
In terms of computer systems that consist of numerous integrated circuits, the supercomputer with the highest transistor count as of 2016 was the Chinese-designed Sunway TaihuLight, which has for all CPUs/nodes combined "about 400 trillion transistors in the processing part of the hardware" and "the DRAM includes about 12 quadrillion transistors, and that's about 97 percent of all the transistors." To compare, the smallest computer, as of 2018 dwarfed by a grain of rice, had on the order of 100,000 transistors. Early experimental solid-state computers had as few as 130 transistors but used large amounts of diode logic. The first carbon nanotube computer had 178 transistors and was a 1-bit one-instruction set computer, while a later one is 16-bit.
Ionic transistor chips, have up to hundreds of such transistors.
Estimates of the total numbers of transistors manufactured:
- Up to 2014:
- Up to 2018:
Transistor count
Microprocessors
A microprocessor incorporates the functions of a computer's central processing unit on a single integrated circuit. It is a multi-purpose, programmable device that accepts digital data as input, processes it according to instructions stored in its memory, and provides results as output.The development of MOS integrated circuit technology in the 1960s led to the development of the first microprocessors. The 20-bit MP944, developed by Garrett AiResearch for the U.S. Navy's F-14 Tomcat fighter in 1970, is considered by its designer Ray Holt to be the first microprocessor. It was a multi-chip microprocessor, fabricated on six MOS chips. However, it was classified by the Navy until 1998. The 4-bit Intel 4004, released in 1971, was the first single-chip microprocessor.
Modern microprocessors typically include on-chip cache memories. The number of transistors used for these cache memories typically far exceeds the number of transistors used to implement the logic of the microprocessor. For example, the last DEC Alpha chip uses 90% of its transistors for cache.
| Processor | Transistor count | Year | Designer | Process | Area | Transistor density |
| MP944 | 74,442 | 1970 | Garrett AiResearch | |||
| Intel 4004 | 2,250 | 1971 | Intel | 10,000 nm | 12 mm2 | 188 |
| TMX 1795 | 3,078 | 1971 | Texas Instruments | 30.64 mm2 | 100.5 | |
| Intel 8008 | 3,500 | 1972 | Intel | 10,000 nm | 14 mm2 | 250 |
| NEC μCOM-4 | 2,500 | 1973 | NEC | 7,500 nm | ||
| Toshiba TLCS-12 | 11,000+ | 1973 | Toshiba | 6,000 nm | 32.45 mm2 | 340+ |
| Intel 4040 | 3,000 | 1974 | Intel | 10,000 nm | 12 mm2 | 250 |
| Motorola 6800 | 4,100 | 1974 | Motorola | 6,000 nm | 16 mm2 | 256 |
| Intel 8080 | 6,000 | 1974 | Intel | 6,000 nm | 20 mm2 | 300 |
| TMS 1000 | 8,000 | 1974 | Texas Instruments | 8,000 nm | 11 mm2 | 730 |
| HP Nanoprocessor | 4639 | 1974 | Hewlett-Packard | 19 mm2 | ||
| MOS Technology 6502 | 4,528 | 1975 | MOS Technology | 8,000 nm | 21 mm2 | 216 |
| Intersil IM6100 | 4,000 | 1975 | Intersil | |||
| CDP 1801 | 5,000 | 1975 | RCA | |||
| RCA 1802 | 5,000 | 1976 | RCA | 5,000 nm | 27 mm2 | 185 |
| Zilog Z80 | 8,500 | 1976 | Zilog | 4,000 nm | 18 mm2 | 470 |
| Intel 8085 | 6,500 | 1976 | Intel | 3,000 nm | 20 mm2 | 325 |
| TMS9900 | 8,000 | 1976 | Texas Instruments | |||
| Bellmac-8 | 7,000 | 1977 | Bell Labs | 5,000 nm | ||
| Motorola 6809 | 9,000 | 1978 | Motorola | 5,000 nm | 21 mm2 | 430 |
| Intel 8086 | 29,000 | 1978 | Intel | 3,000 nm | 33 mm2 | 880 |
| Zilog Z8000 | 17,500 | 1979 | Zilog | 5,000-6,000 nm | 39.31 mm2 | 445 |
| Intel 8088 | 29,000 | 1979 | Intel | 3,000 nm | 33 mm2 | 880 |
| Motorola 68000 | 68,000 | 1979 | Motorola | 3,500 nm | 44 mm2 | 1,550 |
| Intel 8051 | 50,000 | 1980 | Intel | |||
| WDC 65C02 | 11,500 | 1981 | WDC | 3,000 nm | 6 mm2 | 1,920 |
| ROMP | 45,000 | 1981 | IBM | 2,000 nm | 58.52 mm2 | 770 |
| Intel 80186 | 55,000 | 1982 | Intel | 3,000 nm | 60 mm2 | 920 |
| Intel 80286 | 134,000 | 1982 | Intel | 1,500 nm | 49 mm2 | 2,730 |
| WDC 65C816 | 22,000 | 1983 | WDC | 3,000 nm | 9 mm2 | 2,400 |
| NEC V20 | 63,000 | 1984 | NEC | |||
| Motorola 68020 | 190,000 | 1984 | Motorola | 2,000 nm | 85 mm2 | 2,200 |
| Intel 80386 | 275,000 | 1985 | Intel | 1,500 nm | 104 mm2 | 2,640 |
| ARM 1 | 25,000 | 1985 | Acorn | 3,000 nm | 50 mm2 | 500 |
| Novix NC4016 | 16,000 | 1985 | Harris Corporation | 3,000 nm | ||
| SPARC MB86900 | 110,000 | 1986 | Fujitsu | 1,200 nm | ||
| NEC V60 | 375,000 | 1986 | NEC | 1,500 nm | ||
| ARM 2 | 27,000 | 1986 | Acorn | 2,000 nm | 30.25 mm2 | 890 |
| Z80000 | 91,000 | 1986 | Zilog | |||
| NEC V70 | 385,000 | 1987 | NEC | 1,500 nm | ||
| Hitachi Gmicro/200 | 730,000 | 1987 | Hitachi | 1,000 nm | ||
| Motorola 68030 | 273,000 | 1987 | Motorola | 800 nm | 102 mm2 | 2,680 |
| TI Explorer's 32-bit Lisp machine chip | 553,000 | 1987 | Texas Instruments | 2,000 nm | ||
| DEC WRL MultiTitan | 180,000 | 1988 | DEC WRL | 1,500 nm | 61 mm2 | 2,950 |
| Intel i960 | 250,000 | 1988 | Intel | 1,500 nm | ||
| Intel i960CA | 600,000 | 1989 | Intel | 800 nm | 143 mm2 | 4,200 |
| Intel i860 | 1,000,000 | 1989 | Intel | |||
| Intel 80486 | 1,180,235 | 1989 | Intel | 1,000 nm | 173 mm2 | 6,822 |
| ARM 3 | 310,000 | 1989 | Acorn | 1,500 nm | 87 mm2 | 3,600 |
| POWER1 | 6,900,000 | 1990 | IBM | 1,000 nm | 1,283.61 mm2 | 5,375 |
| Motorola 68040 | 1,200,000 | 1990 | Motorola | 650 nm | 152 mm2 | 7,900 |
| R4000 | 1,350,000 | 1991 | MIPS | 1,000 nm | 213 mm2 | 6,340 |
| ARM 6 | 35,000 | 1991 | ARM | 800 nm | ||
| Hitachi SH-1 | 600,000 | 1992 | Hitachi | 800 nm | 100 mm2 | 6,000 |
| Intel i960CF | 900,000 | 1992 | Intel | 125 mm2 | 7,200 | |
| Alpha 21064 | 1,680,000 | 1992 | DEC | 750 nm | 233.52 mm2 | 7,190 |
| Hitachi HARP-1 | 2,800,000 | 1993 | Hitachi | 500 nm | 267 mm2 | 10,500 |
| Pentium | 3,100,000 | 1993 | Intel | 800 nm | 294 mm2 | 10,500 |
| POWER2 | 23,037,000 | 1993 | IBM | 720 nm | 1,217.39 mm2 | 18,923 |
| ARM700 | 578,977 | 1994 | ARM | 700 nm | 68.51 mm2 | 8,451 |
| MuP21 | 7,000 | 1994 | Offete Enterprises | 1,200 nm | ||
| Motorola 68060 | 2,500,000 | 1994 | Motorola | 600 nm | 218 mm2 | 11,500 |
| PowerPC 601 | 2,800,000 | 1994 | Apple, IBM, Motorola | 600 nm | 121 mm2 | 23,000 |
| PowerPC 603 | 1,600,000 | 1994 | Apple, IBM, Motorola | 500 nm | 84.76 mm2 | 18,900 |
| PowerPC 603e | 2,600,000 | 1995 | Apple, IBM, Motorola | 500 nm | 98 mm2 | 26,500 |
| Alpha 21164 EV5 | 9,300,000 | 1995 | DEC | 500 nm | 298.65 mm2 | 31,140 |
| SA-110 | 2,500,000 | 1995 | Acorn, DEC, Apple | 350 nm | 50 mm2 | 50,000 |
| Pentium Pro | 5,500,000 | 1995 | Intel | 500 nm | 307 mm2 | 18,000 |
| PA-8000 64-bit, no cache | 3,800,000 | 1995 | HP | 500 nm | 337.69 mm2 | 11,300 |
| Alpha 21164A EV56 | 9,660,000 | 1996 | DEC | 350 nm | 208.8 mm2 | 46,260 |
| AMD K5 | 4,300,000 | 1996 | AMD | 500 nm | 251 mm2 | 17,000 |
| Pentium II Klamath | 7,500,000 | 1997 | Intel | 350 nm | 195 mm2 | 39,000 |
| AMD K6 | 8,800,000 | 1997 | AMD | 350 nm | 162 mm2 | 54,000 |
| F21 | 15,000 | 1997 | Offete Enterprises | |||
| AVR | 140,000 | 1997 | Nordic VLSI/Atmel | |||
| Pentium II Deschutes | 7,500,000 | 1998 | Intel | 250 nm | 113 mm2 | 66,000 |
| Alpha 21264 EV6 | 15,200,000 | 1998 | DEC | 350 nm | 313.96 mm2 | 48,400 |
| Alpha 21164PC PCA57 | 5,700,000 | 1998 | Samsung | 280 nm | 100.5 mm2 | 56,700 |
| Hitachi SH-4 | 3,200,000 | 1998 | Hitachi | 250 nm | 57.76 mm2 | 55,400 |
| ARM 9TDMI | 111,000 | 1999 | Acorn | 350 nm | 4.8 mm2 | 23,100 |
| Pentium III Katmai | 9,500,000 | 1999 | Intel | 250 nm | 128 mm2 | 74,000 |
| Emotion Engine | 10,500,000 – 13,500,000 | 1999 | Sony, Toshiba | 250 nm | 239.7 mm2 | 43,800 – 56,300 |
| Pentium II Mobile Dixon | 27,400,000 | 1999 | Intel | 180 nm | 180 mm2 | 152,000 |
| AMD K6-III | 21,300,000 | 1999 | AMD | 250 nm | 118 mm2 | 181,000 |
| AMD K7 | 22,000,000 | 1999 | AMD | 250 nm | 184 mm2 | 120,000 |
| Gekko | 21,000,000 | 2000 | IBM, Nintendo | 180 nm | 43 mm2 | 490,000 |
| Pentium III Coppermine | 21,000,000 | 2000 | Intel | 180 nm | 80 mm2 | 263,000 |
| Pentium 4 Willamette | 42,000,000 | 2000 | Intel | 180 nm | 217 mm2 | 194,000 |
| SPARC64 V | 191,000,000 | 2001 | Fujitsu | 130 nm | 290 mm2 | 659,000 |
| Pentium III Tualatin | 45,000,000 | 2001 | Intel | 130 nm | 81 mm2 | 556,000 |
| Pentium 4 Northwood | 55,000,000 | 2002 | Intel | 130 nm | 145 mm2 | 379,000 |
| Itanium 2 McKinley | 220,000,000 | 2002 | Intel | 180 nm | 421 mm2 | 523,000 |
| Alpha 21364 | 152,000,000 | 2003 | DEC | 180 nm | 397 mm2 | 383,000 |
| AMD K7 Barton | 54,300,000 | 2003 | AMD | 130 nm | 101 mm2 | 538,000 |
| AMD K8 | 105,900,000 | 2003 | AMD | 130 nm | 193 mm2 | 548,700 |
| Pentium M Banias | 77,000,000 | 2003 | Intel | 130 nm | 83 mm2 | 928,000 |
| Itanium 2 Madison 6M | 410,000,000 | 2003 | Intel | 130 nm | 374 mm2 | 1,096,000 |
| PlayStation 2 single chip | 53,500,000 | 2003 | Sony, Toshiba | 90 nm 130 nm | 86 mm2 | 622,100 |
| Pentium 4 Prescott | 112,000,000 | 2004 | Intel | 90 nm | 110 mm2 | 1,018,000 |
| Pentium M Dothan | 144,000,000 | 2004 | Intel | 90 nm | 87 mm2 | 1,655,000 |
| SPARC64 V+ | 400,000,000 | 2004 | Fujitsu | 90 nm | 294 mm2 | 1,360,000 |
| Itanium 2 | 592,000,000 | 2004 | Intel | 130 nm | 432 mm2 | 1,370,000 |
| Pentium 4 Prescott-2M | 169,000,000 | 2005 | Intel | 90 nm | 143 mm2 | 1,182,000 |
| Pentium D Smithfield | 228,000,000 | 2005 | Intel | 90 nm | 206 mm2 | 1,107,000 |
| Xenon | 165,000,000 | 2005 | IBM | 90 nm | ||
| Cell | 250,000,000 | 2005 | Sony, IBM, Toshiba | 90 nm | 221 mm2 | 1,131,000 |
| Pentium 4 Cedar Mill | 184,000,000 | 2006 | Intel | 65 nm | 90 mm2 | 2,044,000 |
| Pentium D Presler | 362,000,000 | 2006 | Intel | 65 nm | 162 mm2 | 2,235,000 |
| Core 2 Duo Conroe | 291,000,000 | 2006 | Intel | 65 nm | 143 mm2 | 2,035,000 |
| Dual-core Itanium 2 | 1,700,000,000 | 2006 | Intel | 90 nm | 596 mm2 | 2,852,000 |
| AMD K10 quad-core 2M L3 | 463,000,000 | 2007 | AMD | 65 nm | 283 mm2 | 1,636,000 |
| ARM Cortex-A9 | 26,000,000 | 2007 | ARM | 45 nm | 31 mm2 | 839,000 |
| Core 2 Duo Wolfdale | 411,000,000 | 2007 | Intel | 45 nm | 107 mm2 | 3,841,000 |
| POWER6 | 789,000,000 | 2007 | IBM | 65 nm | 341 mm2 | 2,314,000 |
| Core 2 Duo Allendale | 169,000,000 | 2007 | Intel | 65 nm | 111 mm2 | 1,523,000 |
| Uniphier | 250,000,000 | 2007 | Matsushita | 45 nm | ||
| SPARC64 VI | 540,000,000 | 2007 | Fujitsu | 90 nm | 421 mm2 | 1,283,000 |
| Core 2 Duo Wolfdale 3M | 230,000,000 | 2008 | Intel | 45 nm | 83 mm2 | 2,771,000 |
| Core i7 | 731,000,000 | 2008 | Intel | 45 nm | 263 mm2 | 2,779,000 |
| AMD K10 quad-core 6M L3 | 758,000,000 | 2008 | AMD | 45 nm | 258 mm2 | 2,938,000 |
| Atom | 47,000,000 | 2008 | Intel | 45 nm | 24 mm2 | 1,958,000 |
| SPARC64 VII | 600,000,000 | 2008 | Fujitsu | 65 nm | 445 mm2 | 1,348,000 |
| Six-core Xeon 7400 | 1,900,000,000 | 2008 | Intel | 45 nm | 503 mm2 | 3,777,000 |
| Six-core Opteron 2400 | 904,000,000 | 2009 | AMD | 45 nm | 346 mm2 | 2,613,000 |
| SPARC64 VIIIfx | 760,000,000 | 2009 | Fujitsu | 45 nm | 513 mm2 | 1,481,000 |
| Atom 64-bit, 1-core, 512 kB L2 cache | 123,000,000 | 2010 | Intel | 45 nm | 66 mm2 | 1,864,000 |
| Atom 64-bit, 2-core, 1 MB L2 cache | 176,000,000 | 2010 | Intel | 45 nm | 87 mm2 | 2,023,000 |
| SPARC T3 | 1,000,000,000 | 2010 | Sun/Oracle | 40 nm | 377 mm2 | 2,653,000 |
| Six-core Core i7 | 1,170,000,000 | 2010 | Intel | 32 nm | 240 mm2 | 4,875,000 |
| POWER7 32M L3 | 1,200,000,000 | 2010 | IBM | 45 nm | 567 mm2 | 2,116,000 |
| Quad-core z196 | 1,400,000,000 | 2010 | IBM | 45 nm | 512 mm2 | 2,734,000 |
| Quad-core Itanium Tukwila | 2,000,000,000 | 2010 | Intel | 65 nm | 699 mm2 | 2,861,000 |
| Xeon Nehalem-EX | 2,300,000,000 | 2010 | Intel | 45 nm | 684 mm2 | 3,363,000 |
| SPARC64 IXfx | 1,870,000,000 | 2011 | Fujitsu | 40 nm | 484 mm2 | 3,864,000 |
| Quad-core + GPU Core i7 | 1,160,000,000 | 2011 | Intel | 32 nm | 216 mm2 | 5,370,000 |
| Six-core Core i7/8-core Xeon E5 | 2,270,000,000 | 2011 | Intel | 32 nm | 434 mm2 | 5,230,000 |
| Xeon Westmere-EX | 2,600,000,000 | 2011 | Intel | 32 nm | 512 mm2 | 5,078,000 |
| Atom "Medfield" | 432,000,000 | 2012 | Intel | 32 nm | 64 mm2 | 6,750,000 |
| SPARC64 X | 2,990,000,000 | 2012 | Fujitsu | 28 nm | 600 mm2 | 4,983,000 |
| AMD Bulldozer | 1,200,000,000 | 2012 | AMD | 32 nm | 315 mm2 | 3,810,000 |
| Quad-core + GPU AMD Trinity | 1,303,000,000 | 2012 | AMD | 32 nm | 246 mm2 | 5,297,000 |
| Quad-core + GPU Core i7 Ivy Bridge | 1,400,000,000 | 2012 | Intel | 22 nm | 160 mm2 | 8,750,000 |
| POWER7+ | 2,100,000,000 | 2012 | IBM | 32 nm | 567 mm2 | 3,704,000 |
| Six-core zEC12 | 2,750,000,000 | 2012 | IBM | 32 nm | 597 mm2 | 4,606,000 |
| Itanium Poulson | 3,100,000,000 | 2012 | Intel | 32 nm | 544 mm2 | 5,699,000 |
| Xeon Phi | 5,000,000,000 | 2012 | Intel | 22 nm | 720 mm2 | 6,944,000 |
| Apple A7 | 1,000,000,000 | 2013 | Apple | 28 nm | 102 mm2 | 9,804,000 |
| Six-core Core i7 Ivy Bridge E | 1,860,000,000 | 2013 | Intel | 22 nm | 256 mm2 | 7,266,000 |
| POWER8 | 4,200,000,000 | 2013 | IBM | 22 nm | 650 mm2 | 6,462,000 |
| Xbox One main SoC | 5,000,000,000 | 2013 | Microsoft, AMD | 28 nm | 363 mm2 | 13,770,000 |
| Quad-core + GPU Core i7 Haswell | 1,400,000,000 | 2014 | Intel | 22 nm | 177 mm2 | 7,910,000 |
| Apple A8 | 2,000,000,000 | 2014 | Apple | 20 nm | 89 mm2 | 22,470,000 |
| Core i7 Haswell-E | 2,600,000,000 | 2014 | Intel | 22 nm | 355 mm2 | 7,324,000 |
| Apple A8X | 3,000,000,000 | 2014 | Apple | 20 nm | 128 mm2 | 23,440,000 |
| Xeon Ivy Bridge-EX | 4,310,000,000 | 2014 | Intel | 22 nm | 541 mm2 | 7,967,000 |
| Xeon Haswell-E5 | 5,560,000,000 | 2014 | Intel | 22 nm | 661 mm2 | 8,411,000 |
| Quad-core + GPU GT2 Core i7 Skylake K | 1,750,000,000 | 2015 | Intel | 14 nm | 122 mm2 | 14,340,000 |
| Dual-core + GPU Iris Core i7 Broadwell-U | 1,900,000,000 | 2015 | Intel | 14 nm | 133 mm2 | 14,290,000 |
| Apple A9 | 2,000,000,000+ | 2015 | Apple | 14 nm | 96 mm2 | 20,800,000+ |
| Apple A9 | 2,000,000,000+ | 2015 | Apple | 16 nm | 104.5 mm2 | 19,100,000+ |
| Apple A9X | 3,000,000,000+ | 2015 | Apple | 16 nm | 143.9 mm2 | 20,800,000+ |
| IBM z13 | 3,990,000,000 | 2015 | IBM | 22 nm | 678 mm2 | 5,885,000 |
| IBM z13 Storage Controller | 7,100,000,000 | 2015 | IBM | 22 nm | 678 mm2 | 10,472,000 |
| SPARC M7 | 10,000,000,000 | 2015 | Oracle | 20 nm | ||
| Core i7 Broadwell-E | 3,200,000,000 | 2016 | Intel | 14 nm | 246 mm2 | 13,010,000 |
| Apple A10 Fusion | 3,300,000,000 | 2016 | Apple | 16 nm | 125 mm2 | 26,400,000 |
| HiSilicon Kirin 960 | 4,000,000,000 | 2016 | Huawei | 16 nm | 110.00 mm2 | 36,360,000 |
| Xeon Broadwell-E5 | 7,200,000,000 | 2016 | Intel | 14 nm | 456 mm2 | 15,790,000 |
| Xeon Phi | 8,000,000,000 | 2016 | Intel | 14 nm | 683 mm2 | 11,710,000 |
| Zip CPU | 1,286 6-LUTs | 2016 | Gisselquist Technology | |||
| Qualcomm Snapdragon 835 | 3,000,000,000 | 2016 | Qualcomm | 10 nm | 72.3 mm2 | 41,490,000 |
| Apple A11 Bionic | 4,300,000,000 | 2017 | Apple | 10 nm | 89.23 mm2 | 48,190,000 |
| AMD Zen CCX | 1,400,000,000 | 2017 | AMD | 14 nm | 44 mm2 | 31,800,000 |
| AMD Zeppelin SoC Ryzen | 4,800,000,000 | 2017 | AMD | 14 nm | 192 mm2 | 25,000,000 |
| AMD Ryzen 5 1600 Ryzen | 4,800,000,000 | 2017 | AMD | 14 nm | 213 mm2 | 22,530,000 |
| IBM z14 | 6,100,000,000 | 2017 | IBM | 14 nm | 696 mm2 | 8,764,000 |
| IBM z14 Storage Controller | 9,700,000,000 | 2017 | IBM | 14 nm | 696 mm2 | 13,940,000 |
| HiSilicon Kirin 970 | 5,500,000,000 | 2017 | Huawei | 10 nm | 96.72 mm2 | 56,900,000 |
| Xbox One X main SoC | 7,000,000,000 | 2017 | Microsoft, AMD | 16 nm | 360 mm2 | 19,440,000 |
| Xeon Platinum 8180 | 8,000,000,000 | 2017 | Intel | 14 nm | ||
| Xeon | 7,100,000,000 | 2017 | Intel | 14 nm | 672 mm2 | 10,570,000 |
| POWER9 | 8,000,000,000 | 2017 | IBM | 14 nm | 695 mm2 | 11,500,000 |
| Freedom U500 Base Platform Chip RISC-V | 250,000,000 | 2017 | SiFive | 28 nm | ~30 mm2 | 8,330,000 |
| SPARC64 XII | 5,450,000,000 | 2017 | Fujitsu | 20 nm | 795 mm2 | 6,850,000 |
| Apple A10X Fusion | 4,300,000,000 | 2017 | Apple | 10 nm | 96.40 mm2 | 44,600,000 |
| Centriq 2400 | 18,000,000,000 | 2017 | Qualcomm | 10 nm | 398 mm2 | 45,200,000 |
| AMD Epyc | 19,200,000,000 | 2017 | AMD | 14 nm | 768 mm2 | 25,000,000 |
| Qualcomm Snapdragon 845 | 5,300,000,000 | 2017 | Qualcomm | 10 nm | 94 mm2 | 56,400,000 |
| Qualcomm Snapdragon 850 | 5,300,000,000 | 2017 | Qualcomm | 10 nm | 94 mm2 | 56,400,000 |
| HiSilicon Kirin 710 | 5,500,000,000 | 2018 | Huawei | 12 nm | ||
| Apple A12 Bionic | 6,900,000,000 | 2018 | Apple | 7 nm | 83.27 mm2 | 82,900,000 |
| HiSilicon Kirin 980 | 6,900,000,000 | 2018 | Huawei | 7 nm | 74.13 mm2 | 93,100,000 |
| Qualcomm Snapdragon 8cx / SCX8180 | 8,500,000,000 | 2018 | Qualcomm | 7 nm | 112 mm2 | 75,900,000 |
| Apple A12X Bionic | 10,000,000,000 | 2018 | Apple | 7 nm | 122 mm2 | 82,000,000 |
| Fujitsu A64FX | 8,786,000,000 | 2018 | Fujitsu | 7 nm | ||
| Tegra Xavier SoC | 9,000,000,000 | 2018 | Nvidia | 12 nm | 350 mm2 | 25,700,000 |
| Qualcomm Snapdragon 855 | 6,700,000,000 | 2018 | Qualcomm | 7 nm | 73 mm2 | 91,800,000 |
| AMD Zen 2 core | 475,000,000 | 2019 | AMD | 7 nm | 7.83 mm2 | 60,664,000 |
| AMD Zen 2 CCX | 1,900,000,000 | 2019 | AMD | 7 nm | 31.32 mm2 | 60,664,000 |
| AMD Zen 2 CCD | 3,800,000,000 | 2019 | AMD | 7 nm | 74 mm2 | 51,350,000 |
| AMD Zen 2 client I/O die | 2,090,000,000 | 2019 | AMD | 12 nm | 125 mm2 | 16,720,000 |
| AMD Zen 2 server I/O die | 8,340,000,000 | 2019 | AMD | 12 nm | 416 mm2 | 20,050,000 |
| AMD Zen 2 Renoir die | 9,800,000,000 | 2019 | AMD | 7 nm | 156 mm2 | 62,820,000 |
| AMD Ryzen 7 3700X | 5,990,000,000 | 2019 | AMD | 7 & 12 nm | 199 mm2 | 30,100,000 |
| HiSilicon Kirin 990 4G | 8,000,000,000 | 2019 | Huawei | 7 nm | 90.00 mm2 | 89,000,000 |
| Apple A13 | 8,500,000,000 | 2019 | Apple | 7 nm | 98.48 mm2 | 86,300,000 |
| IBM z15 CP chip | 9,200,000,000 | 2019 | IBM | 14 nm | 696 mm2 | 13,220,000 |
| IBM z15 SC chip | 12,200,000,000 | 2019 | IBM | 14 nm | 696 mm2 | 17,530,000 |
| AMD Ryzen 9 3900X | 9,890,000,000 | 2019 | AMD | 7 & 12 nm | 273 mm2 | 36,230,000 |
| HiSilicon Kirin 990 5G | 10,300,000,000 | 2019 | Huawei | 7 nm | 113.31 mm2 | 90,900,000 |
| AWS Graviton2 | 30,000,000,000 | 2019 | Amazon | 7 nm | ||
| AMD Epyc Rome | 39,540,000,000 | 2019 | AMD | 7 & 12 nm | 1,008 mm2 | 39,226,000 |
| Qualcomm Snapdragon 865 | 10,300,000,000 | 2019 | Qualcomm | 7 nm | 83.54 mm2 | 123,300,000 |
| TI Jacinto TDA4VM | 3,500,000,000 | 2020 | Texas Instruments | 16 nm | ||
| Apple A14 Bionic | 11,800,000,000 | 2020 | Apple | 5 nm | 88 mm2 | 134,100,000 |
| Apple M1 | 16,000,000,000 | 2020 | Apple | 5 nm | 119 mm2 | 134,500,000 |
| HiSilicon Kirin 9000 | 15,300,000,000 | 2020 | Huawei | 5 nm | 114 mm2 | 134,200,000 |
| AMD Zen 3 CCX | 4,080,000,000 | 2020 | AMD | 7 nm | 68 mm2 | 60,000,000 |
| AMD Zen 3 CCD | 4,150,000,000 | 2020 | AMD | 7 nm | 81 mm2 | 51,230,000 |
| Core 11th gen Rocket Lake | 6,000,000,000+ | 2021 | Intel | 14 nm +++ 14 nm | 276 mm2 | 37,500,000 or 21,800,000+ |
| AMD Ryzen 7 5800H | 10,700,000,000 | 2021 | AMD | 7 nm | 180 mm2 | 59,440,000 |
| AMD Epyc 7763 | ? | 2021 | AMD | 7 & 12 nm | 1,064 mm2 | |
| Apple A15 | 15,000,000,000 | 2021 | Apple | 5 nm | 107.68 mm2 | 139,300,000 |
| Apple M1 Pro | 33,700,000,000 | 2021 | Apple | 5 nm | 245 mm2 | 137,600,000 |
| Apple M1 Max | 57,000,000,000 | 2021 | Apple | 5 nm | 420.2 mm2 | 135,600,000 |
| Power10 dual-chip module | 36,000,000,000 | 2021 | IBM | 7 nm | 1,204 mm2 | 29,900,000 |
| Dimensity 9000 | 15,300,000,000 | 2021 | Mediatek | 4 nm | ||
| Apple A16 | 16,000,000,000 | 2022 | Apple | 4 nm | ||
| Apple M1 Ultra | 114,000,000,000 | 2022 | Apple | 5 nm | 840.5 mm2 | 135,600,000 |
| AMD Epyc 7773X | 26,000,000,000 + Milan | 2022 | AMD | 7 & 12 nm | 1,352 mm2 | |
| IBM Telum dual-chip module | 45,000,000,000 | 2022 | IBM | 7 nm | 1,060 mm2 | 42,450,000 |
| Apple M2 | 20,000,000,000 | 2022 | Apple | 5 nm | ||
| Dimensity 9200 | 17,000,000,000 | 2022 | Mediatek | 4 nm | ||
| Qualcomm Snapdragon 8 Gen 2 | 16,000,000,000 | 2022 | Qualcomm | 4 nm | 268 mm2 | 59,701,492 |
| AMD EPYC Genoa 13-chip module + 96 MB | 90,000,000,000 | 2022 | AMD | 5 nm 6 nm | 1,263.34 mm2 12×72.225 396.64 | 71,240,000 |
| HiSilicon Kirin 9000s | 9,510,000,000 | 2023 | Huawei | 7 nm | 107 mm2 | 107,690,000 |
| Apple M4 | 28,000,000,000 | 2024 | Apple | 3 nm | ||
| Apple M3 | 25,000,000,000 | 2023 | Apple | 3 nm | ||
| Apple M3 Pro | 37,000,000,000 | 2023 | Apple | 3 nm | ||
| Apple M3 Max | 92,000,000,000 | 2023 | Apple | 3 nm | ||
| Apple A17 | 19,000,000,000 | 2023 | Apple | 3 nm | 103.8 mm2 | 183,044,315 |
| Sapphire Rapids quad-chip module | 44,000,000,000– 48,000,000,000 | 2023 | Intel | 10 nm ESF | 1,600 mm2 | 27,500,000– 30,000,000 |
| Apple M2 Pro | 40,000,000,000 | 2023 | Apple | 5 nm | ||
| Apple M2 Max | 67,000,000,000 | 2023 | Apple | 5 nm | ||
| Apple M2 Ultra | 134,000,000,000 | 2023 | Apple | 5 nm | ||
| AMD Epyc Bergamo 9-chip module + 128 MB | 82,000,000,000 | 2023 | AMD | 5 nm 6 nm | ||
| AMD Instinct MI300A | 146,000,000,000 | 2023 | AMD | 5 nm 6 nm | 1,017 mm2 | 144,000,000 |
| RV32-WUJI: 3-atom-thick molybdenum disulfide on sapphire; RISC-V architecture | 5931 | 2025 | 3000 nm | |||
| Processor | Transistor count | Year | Designer | Process | Area | Transistor density |