List of semiconductor scale examples

Commercial products using micro-scale MOSFETs

Products featuring 20 μm manufacturing process

• RCA's CD4000 series of integrated circuits beginning in 1968.

  Products featuring 10 μm manufacturing process

• Intel 4004, the first single-chip microprocessor CPU, launched in 1971.
• Intel 8008 CPU launched in 1972.

  Products featuring 8 μm manufacturing process

• Intel 1103, an early dynamic random-access memory chip launched in 1970.
• MOS Technology 6502 1 MHz CPU launched in 1975.

  Products featuring 6 μm manufacturing process

• Toshiba TLCS-12, a microprocessor developed for the Ford EEC system in 1973.
• Intel 8080 CPU launched in 1974 was manufactured using this process.
• The Television Interface Adaptor, the custom graphics and audio chip developed for the Atari 2600 in 1977.
• MOS Technology SID, a programmable sound generator developed for the Commodore 64 in 1982.
• MOS Technology VIC-II, a video display controller developed for the Commodore 64 in 1982.

  Products featuring 3 μm manufacturing process

• Intel 8085 CPU launched in 1976.
• Intel 8086 CPU launched in 1978.
• Intel 8088 CPU launched in 1979.
• Motorola 68000 8 MHz CPU launched in 1979.

  Products featuring 1.5 μm manufacturing process

• NEC's 64kb SRAM memory chip in 1981.
• Intel 80286 CPU launched in 1982.
• The Amiga Advanced Graphics Architecture included chips such as Alice that were manufactured using a 1.5 μm CMOS process.

  Products featuring 1 μm manufacturing process

• NTT's DRAM memory chips, including its 64kb chip in 1979 and 256kb chip in 1980.
• NEC's 1Mb DRAM memory chip in 1984.
• Intel 80386 CPU launched in 1985.

  Products featuring 800 nm manufacturing process

• NTT's 1Mb DRAM memory chip in 1984.
• NEC and Toshiba used this process for their 4Mb DRAM memory chips in 1986.
• Hitachi, IBM, Matsushita and Mitsubishi Electric used this process for their 4Mb DRAM memory chips in 1987.
• Toshiba's 4Mb EPROM memory chip in 1987.
• Hitachi, Mitsubishi and Toshiba used this process for their 1Mb SRAM memory chips in 1987.
• Intel 486 CPU launched in 1989.
• microSPARC I launched in 1992.
• First Intel P5 Pentium CPUs at 60 MHz and 66 MHz launched in 1993.

  Products featuring 600 nm manufacturing process

• Mitsubishi Electric, Toshiba and NEC introduced 16Mb DRAM memory chips manufactured with a 600nm process in 1989.
• NEC's 16Mb EPROM memory chip in 1990.
• Mitsubishi's 16Mb flash memory chip in 1991.
• Intel 80486DX4 CPU launched in 1994.
• IBM/Motorola PowerPC 601, the first PowerPC chip, was produced in 0.6 μm.
• Intel Pentium CPUs at 75 MHz, 90 MHz and 100 MHz.

  Products featuring 350 nm manufacturing process

• Sony's 16Mb SRAM memory chip in 1994.
• NEC VR4300, used in the Nintendo 64 game console.
• Intel Pentium Pro, Pentium, and initial Pentium II CPUs.
• AMD K5 and original AMD K6 CPUs.
• Parallax Propeller, 8 core microcontroller.

  Products featuring 250 nm manufacturing process

• Hitachi's 16Mb SRAM memory chip in 1993.
• Hitachi and NEC introduced 256Mb DRAM memory chips manufactured with this process in 1993, followed by Matsushita, Mitsubishi Electric and Oki in 1994.
• NEC's 1Gb DRAM memory chip in 1995.
• Hitachi's 128Mb NAND flash memory chip in 1996.
• DEC Alpha 21264A, which was made commercially available in 1999.
• AMD K6-2 Chomper and Chomper Extended. Chomper was released on May 28, 1998.
• AMD K6-III "Sharptooth" used 250 nm.
• Mobile Pentium MMX Tillamook, released in August 1997.
• Pentium II Deschutes.
• Dreamcast console's Hitachi SH-4 CPU and PowerVR2 GPU, released in 1998.
• Pentium III Katmai.
• Initial PlayStation 2's Emotion Engine CPU.

  Processors using 180 nm manufacturing technology

• Intel Coppermine E- October 1999
• Sony PlayStation 2 console's Emotion Engine and Graphics Synthesizer – March 2000
• ATI Radeon R100 and RV100 Radeon 7000 – 2000
• AMD Athlon Thunderbird – June 2000
• Intel Celeron (Willamette) – May 2002
• Motorola PowerPC 7445 and 7455 (Apollo 6) – January 2002

  Processors using 130 nm manufacturing technology

• Fujitsu SPARC64 V – 2001
• Gekko by IBM and Nintendo – 2001
• Motorola PowerPC 7447 and 7457 – 2002
• IBM PowerPC G5 970 – October 2002 – June 2003
• Intel Pentium III Tualatin and Coppermine – 2001-04
• Intel Celeron Tualatin-256 – 2001-10-02
• Intel Pentium M Banias – 2003-03-12
• Intel Pentium 4 Northwood- 2002-01-07
• Intel Celeron Northwood-128 – 2002-09-18
• Intel Xeon Prestonia and Gallatin – 2002-02-25
• VIA C3 – 2001
• AMD Athlon XP Thoroughbred, Thorton, and Barton
• AMD Athlon MP Thoroughbred – 2002-08-27
• AMD Athlon XP-M Thoroughbred, Barton, and Dublin
• AMD Duron Applebred – 2003-08-21
• AMD K7 Sempron Thoroughbred-B, Thorton, and Barton – 2004-07-28
• AMD K8 Sempron Paris – 2004-07-28
• AMD Athlon 64 Clawhammer and Newcastle – 2003-09-23
• AMD Opteron Sledgehammer – 2003-06-30
• Elbrus 2000 1891ВМ4Я – 2008-04-27
• MCST-R500S 1891BM3 – 2008-07-27
• Vortex 86SX –

  Commercial products using nano-scale MOSFETs

Chips using 90 nm manufacturing technology

• Sony–Toshiba Emotion Engine+Graphics Synthesizer – 2003
• IBM PowerPC G5 970FX – 2004
• Elpida Memory's 90 nm DDR2 SDRAM process – 2005
• IBM PowerPC G5 970MP – 2005
• IBM PowerPC G5 970GX – 2005
• IBM Waternoose Xbox 360 Processor – 2005
• IBM–Sony–Toshiba Cell processor – 2005
• Intel Pentium 4 Prescott – 2004-02
• Intel Celeron D Prescott-256 – 2004-05
• Intel Pentium M Dothan – 2004-05
• Intel Celeron M Dothan-1024 – 2004-08
• Intel Xeon Nocona, Irwindale, Cranford, Potomac, Paxville – 2004-06
• Intel Pentium D Smithfield – 2005-05
• AMD Athlon 64 Winchester, Venice, San Diego, Orleans – 2004-10
• AMD Athlon 64 X2 Manchester, Toledo, Windsor – 2005-05
• AMD Sempron Palermo and Manila – 2004-08
• AMD Turion 64 Lancaster and Richmond – 2005-03
• AMD Turion 64 X2 Taylor and Trinidad – 2006-05
• AMD Opteron Venus, Troy, and Athens – 2005-08
• AMD Dual-core Opteron Denmark, Italy, Egypt, Santa Ana, and Santa Rosa
• VIA C7 – 2005-05
• Loongson Loongson#Loongson [microprocessor specifications|2Е] STLS2E02 – 2007-04
• Loongson 2F STLS2F02 – 2008-07
• MCST-4R – 2010-12
• Elbrus-2C+ – 2011-11

  Processors using 65 nm manufacturing technology

• Sony–Toshiba EE+GS – 2005
• Intel Pentium 4 – 2006-01-16
• Intel Pentium D 900-series – 2006-01-16
• Intel Celeron D – 2006-05-28
• Intel Core – 2006-01-05
• Intel Core 2 – 2006-07-27
• Intel Xeon – 2006-03-14
• AMD Athlon 64 series – 2007-02-20
• AMD Turion 64 X2 series – 2007-05-07
• AMD Phenom series
• IBM's Cell Processor – PlayStation 3 – 2007-11-17
• IBM's z10 (microprocessor)|z10]
• Microsoft Xbox 360 "Falcon" CPU – 2007–09
• Microsoft Xbox 360 "Opus" CPU – 2008
• Microsoft Xbox 360 "Jasper" CPU – 2008–10
• Microsoft Xbox 360 "Jasper" GPU – 2008–10
• Sun UltraSPARC T2 – 2007–10
• AMD Turion Ultra – 2008-06
• TI OMAP 3 Family – 2008-02
• VIA Nano – 2008-05
• Loongson – 2009
• NVIDIA GeForce 8800GT GPU – 2007

  Processors using 45 nm technology

• Matsushita released the 45 nm Uniphier in 2007.
• Wolfdale, Yorkfield, Yorkfield XE and Penryn are Intel cores sold under the Core 2 brand.
• Intel Core i7 series processors, i5 750
• Pentium Dual-Core Wolfdale-3M are current Intel mainstream dual core sold under the Pentium brand.
• Diamondville, Pineview are current Intel cores with hyper-threading sold under the Intel Atom brand.
• AMD Deneb and Shanghai Quad-Core Processors, Regor dual core processors , Caspian mobile dual core processors.
• AMD "Thuban" Six-Core Processor
• Xenon in the Xbox 360 S model.
• Sony–Toshiba Cell Broadband Engine in PlayStation 3 Slim model – September 2009.
• Samsung S5PC110, as known as Hummingbird.
• Texas Instruments OMAP 36xx.
• IBM POWER7 and z196
• Fujitsu SPARC64 VIIIfx series
• Espresso (microprocessor) Wii U CPU

  Chips using 32 nm technology

• Toshiba produced commercial 32Gb NAND flash memory chips with the 32nm process in 2009.
• Intel Core i3 and i5 processors, released in January 2010
• Intel 6-core processor, codenamed Gulftown
• Intel i7-970, was released in late July 2010, priced at approximately US$900
• AMD FX Series processors, codenamed Zambezi and based on AMD's Bulldozer architecture, were released in October 2011. The technology used a 32 nm SOI process, two CPU cores per module, and up to four modules, ranging from a quad-core design costing approximately US$130 to a $280 eight-core design.
• Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011

  Chips using 24–28 nm technology

• SK Hynix announced that it could produce a 26 nm flash chip with 64 Gb capacity; Intel Corp. and Micron Technology had by then already developed the technology themselves. Announced in 2010.
• Toshiba announced that it was shipping 24 nm flash memory NAND devices on August 31, 2010.
• In 2016 MCST's 28 nm processor Elbrus-8S went for serial production.

  Chips using 22 nm technology

• Intel Core i7 and Intel Core i5 processors based on Intel's Ivy Bridge 22 nm technology for series 7 chip-sets went on sale worldwide on April 23, 2012.

  Chips using 20 nm technology

• Samsung Electronics began mass production of 64Gb NAND flash memory chips using a 20 nm process in 2010.
• Nvidia Tegra X1

  Chips using 16 nm technology

• TSMC first began 16nm FinFET chip production in 2013.
• Nvidia Tegra X1+

  Chips using 14 nm technology

• Intel Core i7 and Intel Core i5 processors based on Intel's Broadwell 14 nm technology was launched in January 2015.
• AMD Ryzen processors based on AMD's Zen or Zen+ architectures and which uses 14 nm FinFET technology.

  Chips using 10 nm technology

• Samsung announced that it had begun mass production of multi-level cell flash memory chips using a 10nm process in 2013. On 17 October 2016, Samsung Electronics announced mass production of SoC chips at 10 nm.
• TSMC began commercial production of 10 nm chips in early 2016, before moving onto mass production in early 2017.
• Samsung began shipping Galaxy S8 smartphone in April 2017 using the company's 10 nm processor.
• Apple delivered second-generation iPad Pro tablets powered with TSMC-produced Apple A10X chips using the 10 nm FinFET process in June 2017.

  Chips using 7 nm technology

• TSMC began risk production of 256 Mbit SRAM memory chips using a 7 nm process in April 2017.
• Samsung and TSMC began mass production of 7 nm devices in 2018.
• Apple A12 and Huawei Kirin 980 mobile processors, both released in 2018, use 7 nm chips manufactured by TSMC.
• AMD began using TSMC 7 nm starting with the Vega 20 GPU in November 2018, with Zen 2-based CPUs and APUs from July 2019, and for both PlayStation 5 and Xbox Series X/S consoles' APUs, released both in November 2020.

  Chips using 5 nm technology

• Samsung began production of 5 nm chips in late 2018.
• TSMC began production of 5 nm chips in April 2019.

  Chips using 3 nm technology

• TSMC have announced plans to release 3nm devices during 2021–2022.
• Samsung Electronics have begun risk production of 3 nm GAAFET transistors in June 2022.
• Apple A17 Pro