List of Intel Core processors


The following is a list of Intel Core processors. This includes Intel's original Core mobile series based on the Enhanced Pentium M microarchitecture; as well as its Core 2–, Core i3–, Core i5–, Core i7–, Core i9–, Core M–, Core 3–, Core 5–, Core 7–, and Core 9–branded processors.

Desktop processors

Core 2

"Allendale" (65 nm, 800 MT/s">Front-side_bus#Transfer_rates">MT/s)

Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.
Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)

Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology.
Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.
Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology
  • All models support: Intel VT-x
  • All E6x50 models support: Intel VT-x, Trusted Execution Technology
  • Die size: 143 mm2
  • Transistor count: 291 million
  • Steppings: B2, G0
Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology.
Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.
Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x, Trusted Execution Technology
  • Die size: 111 mm2
  • Steppings: ?

    "Conroe XE" (65 nm)

These models feature an unlocked clock multiplier
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x, Trusted Execution Technology
  • Die size: 143 mm2
  • Steppings: B1, B2
  • The X6900 was never publicly released.

    "Kentsfield" (65 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x
  • Die size: 2 ×143 mm2
  • Steppings: B3, G0

    "Kentsfield XE" (65 nm)

These models feature an unlocked clock multiplier
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x
  • Die size: 2 ×143 mm2
  • Steppings: B3, G0

    "Wolfdale-3M" (45 nm, 1066 MT/s)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology
  • Die size: 82 mm2
  • Transistor Count: 230 million
  • Steppings: M0, R0
  • Models with a part number ending in "ML" instead of "M" support Intel VT-x

    "Wolfdale" (45 nm, 1333 MT/s)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, iAMT2, Intel VT-x, Intel VT-d, Trusted Execution Technology
  • Die size: 107 mm2
  • Transistor Count: 410 million
  • Steppings: C0, E0
Note: The E8190 and E8290 do not support Intel VT-d.
Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM, but none was offered in retail PCs.
See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x, Intel VT-d, Trusted Execution Technology
  • Die size: 2 × 82 mm2
  • Steppings: M0, M1, R0
  • All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.
Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.
Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.
Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x, Intel VT-d, Trusted Execution Technology
  • Die size: 2 × 107 mm2
  • The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC.
  • Steppings: C0, C1, E0

    "Yorkfield XE" (45 nm)

  • These models feature an unlocked clock multiplier
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Active Management Technology, Intel VT-x
  • I/O Acceleration Technology supported by: QX9775
  • Intel VT-d supported by: QX9650
  • Die size: 2 × 107 mm2
  • Steppings: C0, C1, E0
  • The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.

    Core i (1st gen)

Lynnfield

Common features:
  • Socket: LGA 1156.
  • All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset.
  • No integrated graphics.
  • L1 cache: 64 KB per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.

    Bloomfield

Common features:
  • Socket: LGA 1366.
  • All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
  • PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
  • All CPUs feature a QPI bus to the chipset.
  • * Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
  • No integrated graphics.
  • L1 cache: 64 KB per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • Extreme Edition processors have an unlocked multiplier and can be overclocked.

    Clarkdale32 nm dual-core)">

Common features:
  • Socket: LGA 1156.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset.
  • L1 cache: 64 KB per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.

    Gulftown

Common features:
  • Socket: LGA 1366.
  • All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
  • PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
  • All CPUs feature a QPI bus to the chipset.
  • * Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
  • No integrated graphics.
  • L1 cache: 64 KB per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • X-suffix processors have an unlocked multiplier and can be overclocked.

    Core i (2nd gen)

Sandy Bridge-DT

Common features:
  • Socket: LGA 1155.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset.
  • L1 cache: 64 KB per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i3-2120, i5-2400, and i7-2600 are available as embedded processors.
  • The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

    Core i (3rd gen)

Ivy Bridge-DT

Common features:
  • Socket: LGA 1155.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset.
  • L1 cache: 64 KB per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i3-3220, i5-3550S and i7-3770 are available as embedded processors.