An acoustic emission sensor system for thin layer crack detection
An acoustic emission sensor system for thin layer crack detection is a scholarly work, published in 2018 in ''Microelectronics Reliability''. The main subjects of the publication include indentation, acoustics, surface acoustic wave, semiconductor wafer, optoelectronics, diamond, -, layer, failure analysis, electronic engineering, chemical-mechanical planarization, semiconductor, materials science, thin film, sensitivity, and acoustic emission. The authors present a new method for semiconductor layer characterization enabling simultaneous crack generation and detection based on the established acoustic emission testing.