Trimethylsilane
Trimethylsilane is the organosilicon compound with the formula 3SiH. It is a trialkylsilane. The Si-H bond is reactive. Being a gas, it is less commonly used as a reagent than the related triethylsilane, which is a liquid at room temperature.
Trimethylsilane is used in the semiconductor industry as precursor to deposit dielectrics and barrier layers via plasma-enhanced chemical vapor deposition. It is also used a source gas to deposit TiSiCN hard coatings via plasma-enhanced magnetron sputtering. It has also been used to deposit silicon carbide hard coatings via low-pressure chemical vapor deposition at relatively low temperatures under 1000 °C. It is an expensive gas but safer to use than silane ; and produces properties in the coatings that cannot be undertaken by multiple source gases containing silicon and carbon.