Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure
Thermal Resistance Analysis of Light-Emitting Diode Modules with Thermal Via Structure is a scholarly work, published in 2018 in ''Journal of Electronic Materials''. The main subjects of the publication include optoelectronics, optical interconnect, diode, engineering physics, thermal resistance, solid-state physics, thermal, materials science, and thermal analysis. Light-emitting diodes (LEDs) convert 15% of the applied energy to light and the remaining 85% to heat.