Stretchable microelectrode array
Stretchable microelectrode arrays are a specialized type of microelectrode array with a key advantage; they can be deformed, stretched, bent, and twisted while maintaining electrical functionality whereas standard MEAs break upon mechanical loading. Flexible MEAs, which are often confounded with stretchable MEAs, lie in between stretchable MEAs and standard MEA in terms of their mechanical properties because they bend and twist to some degree, but not stretch.
Just like traditional MEAs, stretchable MEAs consist of a few thousand microelectrodes that allow recording or stimulation of electrical signals from cells, and are used in vivo in a living being or in vitro with cell cultures.
Theory
A stretchable conductor typically consists of two components: an elastomeric insulator and an electrical conductor. There are several approaches to producing stretchable and electrical conducting materials that fall into two categories: structural design and material innovation.Material innovation
- Electronic Fillers: This is the oldest approach to making an elastomeric material elastically stretchable. In principle, rigid and electrically conductive materials and mixed with an elastomeric polymer before curing to create stretchable composites. If the concentration of the electrically conductive filler is high enough they form a mesh-like percolation network that facilitates the free movement of charge carriers through contact junctions. The minimum concentration of the electronic filler material that is required to create conductive pathways for charge carrier transport through the elastomer is called the percolation threshold. The percolation threshold is usually indicated as weight percentage or volume percentage of the filler material, and ranges from less than 1wt% for high aspect ration carbon nanotubes to over 15wt%. The type of filler materials ranges from metals in powder or nanowire form, carbon as graphite or nanotubes, to electrically conducting polymers.
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'Wavy' Nanowires and Nanoribbons: The spontaneous formation of wavy patterns of aligned buckles that is caused by the deposition of a thin gold film on the surface of the elastomer polydimethylsiloxane was first described by the group of George Whitesides at Harvard University in 2000. The gold was deposited on warmed PDMS, and, upon cooling and the associated thermal shrinkage of the elastomer, the gold film comes under compressive stress which is relieved by creating buckles. In subsequent years, the group of John Rogers at the University of Urbana Champaign has developed the technology to bond very thin silicon ribbons to a pre-stretched PDMS membrane. Upon relaxation of the per-stretch, the compressive mechanical stress in the silicon ribbons is relieved by creating wavy buckles in the PDMS. As silicon is a brittle material, the ribbons need to very thin to stay intact during buckling. - Liquid Metals: A metal or alloy that is liquid at room temperature can be enclosed in PDMS and used as a stretchable conductor. Mercury is the only pure metal that is liquid at room temperature but has limited application due to its neurotoxicity. Cesium melts at 28.5 °C, but reacts violently when exposed to air and is therefore not suitable for this application. Most researchers therefore use an eutectic mixture of Indium and Gallium, so called EGaIn, which has a melting point is 15.7 °C and consists of 75.5% Gallium and 24.5% Indium. A eutectic mixture of Ga, In and Sn, also known as Galinstan, is another popular choice and has a melting point of 10.5 °C.
- Microcracked gold thin film: When a thin gold film is deposited on PDMS under certain conditions, the gold film adopts a microcracked morphology which makes the gold stretchable. The maximum strain of the film decreases with the length and increases with the width of the conductor.
Structural design
- Geometric patterning, fractal patterns: Metal traces are deposited in specific patterns, such as meandering or serpentine shapes, within a stretchable elastomeric substrate to accommodate strain. The resulting structure is akin to a 2-dimensional spring. The University of Ghent and IMEC in Belgium have pioneered the approach to using Meander shaped metallic structures.
- * The group of John Rogers increased the maximum strain in devices created by this approach using fractal-based structures. These fractal patterns are characterized by self-similarity, i.e., a small sections of the structure yields pieces with geometries that resemble the whole structure.
- *These fractal patterns include Koch, Peano, Hilbert lines, Moore, Vicsek loops, and Greek crosses.
- Origami-inspired structures, and kirigami cuts: Intrinsically rigid or inelastic flexible materials can be turned into stretchable materials by applying origami technology and kirigami cuts.
History
In subsequent years, the number of research papers that describes different approaches to fabricating sMEAs and their use for in vitro and in vivo research has increased immensely.
Types and capabilities
Stretchable microelectrode arrays can be categorized whether they are used with cells or tissue slices in a dish or whether they are implanted in an animal or human.In vitro stretchable MEAs
sMEAs are used in vitro to record and stimulate electrophysiological activity in dissociated cells, tissue slices or organoids. In vitro use of sMEAs may include stretching of the cells. The cells are either harvested from an animal or were derived from human induced pluripotent stem cells.The form factor of sMEAs is often similar to rigid MEAs because the same data acquisition systems can be used for both types of MEAs. The main differences between sMEAs and rigid MEAs are summarized below:
- Number of microelectrodes:sMEAs usually have 60 or less microelectrodes whereas rigid MEAs have 60 electrodes in the standard configuration but can have several thousand electrodes in CMOS devices.
- Diameter of the recording sites: The recording site diameter is typically 50-100μm for sMEAs and 10-30 μm for glass MEAs, but can be less than 10μm in CMOS MEAs.
- Spacing between microelectrodes: The spacing between microelectrodes is typically larger than 300μm for sMEAs and 200 μm for glass MEAs. but can be less than 20μm in CMOS MEAs.