List of Intel Atom processors

Intel Atom is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.
For nettop and netbook Atom microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

[Nettop] processors (small desktop)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, Hyper-Threading
Transistors: 47 million
Die size: 25.96 mm²
Package size: 22 mm × 22 mm

"Pineview">Pineview (microprocessor)">Pineview" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, Hyper-Threading
Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller
Transistors: 123 million, 176 million
Die size: 66 mm², 87 mm²
Package size: 22 mm × 22 mm

Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)">Cedarview" (32 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, Hyper-Threading
Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller
Package size: 22 mm × 22 mm

[Netbook] processors (sub-notebook)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
Transistors: 47 million
Die size: 26 mm²
Package size: 22 mm × 22 mm

"Pineview">Pineview (microprocessor)#Pineview microprocessor">Pineview" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB
Transistors: 123 million, 176 million
Die size: 66 mm², 87 mm²
Package size: 22 mm × 22 mm

Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)#Cedarview microprocessor">Cedarview" (32 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller
Package size: 22 × 22 mm

MID">List of Intel mobile Internet device platforms">MID processors/SoCs ([UMPC]/[Smartphone]/IoT">Internet of things">IoT)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Silverthorne">Silverthorne (microprocessor)">Silverthorne" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
Model Z515 supports Intel Burst Performance Technology
Uses the Poulsbo chipset.
Transistors: 47 million
Die size: 26 mm²
Package size: 13 mm × 14 mm / 22 mm × 22 mm

"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.
Transistors: 140 million
Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
Package size: 13.8 mm × 13.8 × 1.0 mm
Steppings: C0

Saltwell microarchitecture

"Penwell">Penwell (SoC)">Penwell" (32 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Intel Burst Performance Technology, Hyper-Threading.
Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller
Package size: 12 mm × 12 × 1.0 mm
Transistors: 140 million
Die size: 65.2526 mm²

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Merrifield">Silvermont">Merrifield" (22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology.
Z3480 also supports Intel Wireless Display.
Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
Package size: 12 mm × 12 × 1.0 mm

"Moorefield">Silvermont">Moorefield" (22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology, Intel Wireless Display.
GPU and memory controller are integrated onto the processor die
Package size: 14 mm × 14 × 1.0 mm

"SoFIA">Rockchip#Tablet processors with integrated modem">SoFIA" (28 nm)

SoFIA
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI
GPU and memory controller are integrated onto the processor die
Package size: 34 × 40 mm
SoFIA 3G SoC with Silvermont CPU
*Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
SoFIA 3G–R SoC with Silvermont CPU
*Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
SoFIA LTE with Airmont CPU
*Integrated LTE Cat. 4, SMARTi 4.5, LnP/ CG2000, PMIC

Tablet">Tablet computer#Intel tablet platforms">Tablet processors/SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die
Transistors: 140 million
Die size: 7.34 mm × 8.89 mm = 65.2526 mm²
Package size: 13.8 mm × 13.8 × 1.0 mm
Steppings: C0

Saltwell microarchitecture

"Cloverview">Cloverview (SoC)">Cloverview" (32 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading, Intel Burst Performance Technology.
GPU and memory controller are integrated onto the processor die
Package size: 13.8 mm × 13.8 × 1.0 mm
Steppings:B1, C0

No official TDP available. For power data see page 129–130.

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-T">Silvermont">Bay Trail-T" (22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI, TXT/TXE
Package size: 17 mm × 17 × 1.0 mm

Type 4 SoC:

DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
Display controller with 2 MIPI DSI ports and 2 DDI ports
Integrated Intel HD Graphics (Gen7) GPU
One USB 3.0 controller supporting one USB 3.0 port
One USB 2.0 controller supporting four ports
Integrated LPE audio controller
Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART, I2C or PWM

Type 3 SoC:

DDR3L/L-RS single-channel memory controller supporting up to 2 GB
Display controller with 1 MIPI DSI port and 2 DDI ports
Integrated Intel HD Graphics (Gen7) GPU
One USB controller supporting two USB 2.0 ports
Integrated LPE audio controller
Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART, I2C or PWM

Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Cherry Trail-T">Silvermont">Cherry Trail-T" (14 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x2
Integrated Intel HD Graphics (Gen8) GPU
One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
One USB xDCI controller supporting one USB 3.0 port
Integrated LPE audio controller
Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART, I2C or PWM

Type 3 SoC:

DDR3L/L-RS single-channel memory controller supporting up to 2 GB
PCI Express 2.0 controller with 1 lane
Display controller with 2 MIPI DSI ports and 2 DDI ports
Integrated Intel HD Graphics (Gen8) GPU
One USB controller supporting three USB 2.0 ports and two HSIC ports
Integrated LPE audio controller
Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
Serial I/O supporting SPI, UART, I2C or PWM

Embedded">Embedded system">Embedded processors/SoC">System on a chip">SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Tunnel Creek">Tunnel Creek (microprocessor)">Tunnel Creek" (45 nm)

CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, hyper-threading, Intel VT-x.
Package size: 22 mm × 22 mm
Steppings: B0
Temperature range: for : 0 °C to +70 °C, for : -40 °C to +85 °C.
DDR2 single-channel memory controller supporting up to 2 GB
PCI Express 1.0a controller with 4 lanes
Display controller with LVDS and serial DVO ports
Integrated GMA600 GPU
Integrated HD audio controller
Serial I/O supporting SPI

"Stellarton">Stellarton (microprocessor)">Stellarton" (45 nm)

"Tunnel Creek" CPU with an Altera Field Programmable Gate Array
CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Hyper-Threading, Intel VT-x
Package size: 37.5 mm × 37.5 mm
Steppings: B0
TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
Temperature range: for : 0 °C to +70 °C, for : -40 °C to +85 °C.
DDR2 single-channel memory controller supporting up to 2 GB
PCI Express 1.0a controller with 4 lanes
Display controller with LVDS and serial DVO ports
Integrated GMA600 GPU
Integrated HD audio controller
Serial I/O supporting SPI

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-I">Silvermont">Bay Trail-I" (22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, TXT/TXE
Package size: 25 mm × 27 mm
DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
Display controller with 2 DDI ports
Integrated Intel HD Graphics (Gen7) GPU
PCI Express 2.0 controller with four lanes and four root ports
Two SATA-300 ports
One USB 3.0 controller supporting one USB 3.0 port
One USB 2.0 controller supporting four ports
Integrated LPE and HD audio controllers
Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video
Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC
Serial I/O supporting SPI, UART, I2C or PWM

Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Braswell">Silvermont">Braswell" (14 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI.
GPU and memory controller are integrated onto the processor die
GPU is based on Broadwell Intel HD Graphics, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2.
Package size: 25 mm × 27 mm

Goldmont microarchitecture">Goldmont">Goldmont microarchitecture

"Apollo Lake">Goldmont">Apollo Lake" (14 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, Intel VT-d, AES-NI, TXT/TXE
Package size: 24 mm × 31 mm
DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC
Display controller with 1 MIPI DSI port and 2 DDI ports
Integrated Intel HD Graphics (Gen9) GPU
PCI Express 2.0 controller supporting 6 lanes ; 4 lanes available externally
Two USB 3.0 ports
Two USB 2.0 ports
Two SATA-600 ports
Integrated HD audio controller
Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
Serial I/O supporting SPI, HSUART and I2C

Tremont microarchitecture">Tremont (microarchitecture)">Tremont microarchitecture

"Elkhart Lake">Tremont (microarchitecture)">Elkhart Lake" (10 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit, Intel VT-x, Intel VT-d, AES-NI.
GPU is based on Gen11 Intel HD Graphics, with up to 32 execution units, and supports up to 3 displays through HDMI, DP, eDP, or DSI.
SoC peripherals include 4 × USB 2.0/3.0/3.1, 2 × SATA, 3 × 2.5GbE LAN, UART, and up to 8 lanes of PCI Express 3.0 in x4, x2, and x1 configurations.
Package size: 35 mm × 24 mm

Gracemont microarchitecture">Gracemont (microarchitecture)">Gracemont microarchitecture

"Amston Lake" (7 nm)

In Q2 2024 Intel launched these cpus: Atom® x7203C, Atom® x7211RE, Atom® x7213RE, Atom® x7405C, Atom® x7433RE, Atom® x7809C, Atom® x7835RE. These processors have 2-8 cpu cores and use 6-25 watts of power.

Server">Server (computing)">Server SoCs

All Atom server processors include ECC support.

Saltwell microarchitecture">Bonnell (microarchitecture)">Saltwell microarchitecture

"Centerton">Centerton (SoC)">Centerton" (32 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

"Briarwood">Briarwood (SoC)">Briarwood" (32 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Hyper-threading, Intel 64, Intel VT-x, ECC memory.

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Avoton">Silvermont">Avoton" (22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel Turbo Boost, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
Dual-core SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 4 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
Quad-core SoC peripherals include 4 × USB 2.0, 2 or 6 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
C2730 SoC peripherals include 4 × USB 2.0, 2 × SATA, 2 × Integrated GbE LAN, 2 × UART, and 8 lanes of PCI Express 2.0, in x8, x4, x2, and x1 configurations.
C2750 SoC peripherals include 4 × USB 2.0, 6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
Package size: 34 mm × 28 mm
Die size: 107 mm²

"Rangeley">Silvermont">Rangeley" (22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel Turbo Boost, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
All models except C2x38 support Intel QuickAssist Technology
SoC peripherals include 4 × USB 2.0, 4-6 × SATA, 4 × Integrated GbE LAN, 2 × UART, and 8-16 lanes of PCI Express 2.0, in x16, x8, x4, x2, and x1 configurations.
Package size: 34 mm × 28 mm

Goldmont microarchitecture">Goldmont">Goldmont microarchitecture

"Denverton">Goldmont">Denverton" (14 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel Turbo Boost, Intel 64, XD bit, Intel VT-x, Intel VT-d, AES-NI, ECC memory.
SoC peripherals include 8–16 × USB 3.0, 6–16 × SATA, 4 × Integrated 1GbE, 2.5GbE, and 10GbE LAN, and up to 20 lanes of PCI Express 3.0, in x8, x4, and x2 configurations.
Package size: 34 mm × 28 mm

Tremont microarchitecture">Tremont (microarchitecture)">Tremont microarchitecture

"Snow Ridge">Tremont (microarchitecture)">Snow Ridge" (10 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores.
SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express, in x16, x8, and x4 configurations.
Intel Dynamic Load Balancer & Intel QuickAssist Technology
P####B models are designed for base transceiver stations, especially that for 5G networks. All other models are designed for communications.
Package size: 47.5 mm × 47.5 mm

"Parker Ridge">Tremont (microarchitecture)">Parker Ridge" (10 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express, in x16, x8, and x4 configurations.
Intel Dynamic Load Balancer & Intel QuickAssist Technology
Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range.
Package size: 47.5 mm × 47.5 mm

List of Intel Atom processors

[Nettop] processors (small desktop)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

"Pineview">Pineview (microprocessor)">Pineview" (45 nm)

Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)">Cedarview" (32 nm)

[Netbook] processors (sub-notebook)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

"Pineview">Pineview (microprocessor)#Pineview microprocessor">Pineview" (45 nm)

Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)#Cedarview microprocessor">Cedarview" (32 nm)

MID">List of Intel mobile Internet device platforms">MID processors/SoCs ([UMPC]/[Smartphone]/IoT">Internet of things">IoT)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Silverthorne">Silverthorne (microprocessor)">Silverthorne" (45 nm)

"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

Saltwell microarchitecture

"Penwell">Penwell (SoC)">Penwell" (32 nm)

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Merrifield">Silvermont">Merrifield" (22 nm)

"Moorefield">Silvermont">Moorefield" (22 nm)

"SoFIA">Rockchip#Tablet processors with integrated modem">SoFIA" (28 nm)

Tablet">Tablet computer#Intel tablet platforms">Tablet processors/SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

Saltwell microarchitecture

"Cloverview">Cloverview (SoC)">Cloverview" (32 nm)

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-T">Silvermont">Bay Trail-T" (22 nm)

Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Cherry Trail-T">Silvermont">Cherry Trail-T" (14 nm)

Embedded">Embedded system">Embedded processors/SoC">System on a chip">SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Tunnel Creek">Tunnel Creek (microprocessor)">Tunnel Creek" (45 nm)

"Stellarton">Stellarton (microprocessor)">Stellarton" (45 nm)

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-I">Silvermont">Bay Trail-I" (22 nm)

Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Braswell">Silvermont">Braswell" (14 nm)

Goldmont microarchitecture">Goldmont">Goldmont microarchitecture

"Apollo Lake">Goldmont">Apollo Lake" (14 nm)

Tremont microarchitecture">Tremont (microarchitecture)">Tremont microarchitecture

"Elkhart Lake">Tremont (microarchitecture)">Elkhart Lake" (10 nm)

Gracemont microarchitecture">Gracemont (microarchitecture)">Gracemont microarchitecture

"Amston Lake" (7 nm)

Server">Server (computing)">Server SoCs

Saltwell microarchitecture">Bonnell (microarchitecture)">Saltwell microarchitecture

"Centerton">Centerton (SoC)">Centerton" (32 nm)

"Briarwood">Briarwood (SoC)">Briarwood" (32 nm)

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Avoton">Silvermont">Avoton" (22 nm)

"Rangeley">Silvermont">Rangeley" (22 nm)

Goldmont microarchitecture">Goldmont">Goldmont microarchitecture

"Denverton">Goldmont">Denverton" (14 nm)

Tremont microarchitecture">Tremont (microarchitecture)">Tremont microarchitecture

"Snow Ridge">Tremont (microarchitecture)">Snow Ridge" (10 nm)

"Parker Ridge">Tremont (microarchitecture)">Parker Ridge" (10 nm)

CE">Intel Consumer Electronics">CE SoCs

Single-core CE SoCs

"Sodaville">Sodaville (SoC)">Sodaville" (45 nm)

"Groveland">Groveland (SoC)">Groveland" (45 nm)

Dual-Core CE SoCs

"Berryville">Berryville (SoC)">Berryville" (32 nm)