Centrino
Centrino was a brand name of Intel Corporation which represented its Wi-Fi and WiMAX wireless computer networking adapters. The brand name was first used by the company as a platform-marketing initiative. The change of the meaning of the brand name occurred on January 7, 2010. The Centrino name for laptops was replaced by the Ultrabook.
The old platform-marketing brand name covered a particular combination of mainboard chipset, mobile CPU and wireless network interface in the design of a laptop. Intel claimed that systems equipped with these technologies delivered better performance, longer battery life and broader wireless network interoperability than non-Centrino systems.
The product line name for Intel wireless products became Intel Centrino Wireless in 2010. The Centrino brand was ultimately discontinued in 2013.
Intel Centrino
Notebook implementations
Carmel platform (2003)
Intel used "Carmel" as the codename for the first-generation Centrino platform, introduced in March 2003.| Centrino | Carmel platform |
| Mobile chipset | an Intel Mobile 855 Express series chipset, including ICH4M southbridge. |
| Mobile processor | Processors - Socket 479 |
| Wireless network | an Intel PRO/Wireless 2100B or later 2200BG mini-PCI Wi-Fi adapter. |
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino laptops.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for laptops to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed laptop manufacturers to create thinner and lighter laptops because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform (2005)
Intel used Sonoma as the codename for the second-generation Centrino platform, introduced in January 2005.| Centrino | Sonoma platform |
| Mobile chipset | an Intel Mobile 915 Express series chipset, including ICH6M southbridge.
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| Mobile processor | Processors - Socket 479 |
| Wireless network | an Intel PRO/Wireless 2200BG or 2915ABG mini-PCI Wi-Fi adapter. |
Napa platform (2006)
The codename Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27, 2006 onwards.| Centrino | Napa platform |
| Mobile chipset | an Intel Mobile 945 Express series chipset, including ICH7M southbridge.
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| Mobile processor | Processors - Socket M / Micro-FCBGA |
| Wireless network | an Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter. |
Santa Rosa platform (2007)
The codename Santa Rosa refers to the fourth-generation Centrino platform, which was released on May 10, 2007.| Centrino | Santa Rosa platform |
| Mobile chipset | an Intel Mobile 965 Express series chipset : GM965 with Intel GMA X3100 graphics technology or PM965 with discrete graphics, and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization.
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| Mobile processor | Processors - Socket P / Socket M / Micro-FCBGA |
| Wireless network | an Intel WiFi Link 4965AGN mini-PCIe Wi-Fi adapter. |
The wireless chipset update was originally intended to include WWAN Internet access via HSDPA, co-developed with Nokia. After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology. Support for WiMAX was originally scheduled for inclusion in Santa Rosa but was later delayed until Montevina in 2008.
It is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and "Centrino Duo" when they are not used.
Montevina platform (2008)
The codename Montevina refers to the fifth-generation Centrino platform, now formally named Centrino 2 to avoid confusion with previous Centrino platforms. It was scheduled for release at Computex Taipei 2008, which took place on June 3–7, 2008, but was delayed until July 15, due to problems with integrated graphics and wireless certification.| Centrino | Montevina platform |
| Mobile chipset | an Intel Mobile Express series 4 chipset with Intel GMA X4500 graphics technology and ICH9M southbridge, 1066 MT/s FSB. The GM45/GS45 graphics core is clocked at 533 MHz and 400 MHz for GL40, which contains ten unified shaders, up from the eight provided by GMA X3100.
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| Mobile processor | Processors - Socket P / Socket M / Micro-FCBGA |
| Wireless network | Wireless Modules |