Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects is a scholarly work, published in 2019 in ''Journal of Electronic Packaging''. The main subjects of the publication include chip, finite-difference time-domain method, Galerkin method, thermal conduction, physics-informed neural networks, nonlinear system, projection, microelectronics, transient, time domain, Model order reduction, materials science, boundary value problem, computer science, finite element method, electronic engineering, heat transfer, electrostatic discharge, and mechanics. Therefore, a computational tool is needed to not only analyze but also accurately predict spatial and temporal temperature distribution while minimizing the computational effort within the chip architecture.