Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process
Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process is a scholarly work, published in 2018 in ''Journal of Physics: Conference Series''. The main subjects of the publication include engineering drawing, materials science, paper studies, stencil, process, mechanical engineering, solder, and computer science. It is found that squeegee angle 60° to 80° has potential to obtain the good print quality of solder paste.