Microstructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior
Microstructure of TiCuO Films on Copper Ion Release and Endothelial Cell Behavior is a scholarly work, published in 2018 in ''Journal of Inorganic Materials''. The main subjects of the publication include ion, nanotechnology, composite material, Low-k dielectric, metallurgy, atomic layer deposition, chemical engineering, microstructure, polymer nanocomposite, materials science, and copper.