List of Intel Atom processors


is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.
For nettop and netbook Atom microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

[Nettop] processors (small desktop)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, Hyper-Threading
  • Transistors: 47 million
  • Die size: 25.96 mm2
  • Package size: 22 mm × 22 mm

    "Pineview">Pineview (microprocessor)">Pineview" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, Hyper-Threading
  • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller
  • Transistors: 123 million, 176 million
  • Die size: 66 mm2 , 87 mm2
  • Package size: 22 mm × 22 mm

    Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)">Cedarview" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit, Hyper-Threading
  • Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller
  • Package size: 22 mm × 22 mm

    [Netbook] processors (sub-notebook)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Transistors: 47 million
  • Die size: 26 mm2
  • Package size: 22 mm × 22 mm

    "Pineview">Pineview (microprocessor)#Pineview microprocessor">Pineview" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB
  • Transistors: 123 million, 176 million
  • Die size: 66 mm2 , 87 mm2
  • Package size: 22 mm × 22 mm

    Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)#Cedarview microprocessor">Cedarview" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Integrated PowerVR SGX545-based Intel GMA 3600/GMA 3650 GPU and DDR3 single-channel memory controller
  • Package size: 22 × 22 mm

    [List of Intel [mobile Internet device platforms|MID]] processors/SoCs ([UMPC]/[Smartphone]/IoT">Internet of things">IoT)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Silverthorne">Silverthorne (microprocessor)">Silverthorne" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
  • Model Z515 supports Intel Burst Performance Technology
  • Uses the Poulsbo chipset.
  • Transistors: 47 million
  • Die size: 26 mm2
  • Package size: 13 mm × 14 mm / 22 mm × 22 mm

    "Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
  • GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.
  • Transistors: 140 million
  • Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
  • Package size: 13.8 mm × 13.8 × 1.0 mm
  • Steppings: C0

    Saltwell microarchitecture

"Penwell">Penwell (SoC)">Penwell" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Intel Burst Performance Technology, Hyper-Threading.
  • Integrated PowerVR SGX540 GPU and DDR3 single-channel memory controller
  • Package size: 12 mm × 12 × 1.0 mm
  • Transistors: 140 million
  • Die size: 65.2526 mm2

    Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Merrifield">Silvermont">Merrifield" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology.
  • Z3480 also supports Intel Wireless Display.
  • Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
  • Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
  • Package size: 12 mm × 12 × 1.0 mm

    "Moorefield">Silvermont">Moorefield" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology, Intel Wireless Display.
  • GPU and memory controller are integrated onto the processor die
  • Package size: 14 mm × 14 × 1.0 mm

    "SoFIA">Rockchip#Tablet processors with integrated modem">SoFIA" (28 nm)

  • SoFIA
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI
  • GPU and memory controller are integrated onto the processor die
  • Package size: 34 × 40 mm
  • SoFIA 3G SoC with Silvermont CPU
  • *Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
  • SoFIA 3G–R SoC with Silvermont CPU
  • *Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
  • SoFIA LTE with Airmont CPU
  • *Integrated LTE Cat. 4, SMARTi 4.5, LnP/ CG2000, PMIC

    Tablet">Tablet computer#Intel tablet platforms">Tablet processors/SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
  • GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die
  • Transistors: 140 million
  • Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
  • Package size: 13.8 mm × 13.8 × 1.0 mm
  • Steppings: C0

    Saltwell microarchitecture

"Cloverview">Cloverview (SoC)">Cloverview" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading, Intel Burst Performance Technology.
  • GPU and memory controller are integrated onto the processor die
  • Package size: 13.8 mm × 13.8 × 1.0 mm
  • Steppings:B1, C0
No official TDP available. For power data see page 129–130.

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-T">Silvermont">Bay Trail-T" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI, TXT/TXE
  • Package size: 17 mm × 17 × 1.0 mm
Type 4 SoC:
  • DDR3L single-channel or LPDDR3 dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
  • Display controller with 2 MIPI DSI ports and 2 DDI ports
  • Integrated Intel HD Graphics GPU
  • One USB 3.0 controller supporting one USB 3.0 port
  • One USB 2.0 controller supporting four ports
  • Integrated LPE audio controller
  • Integrated image signal processor supporting two MIPI CSI ports, 24 MP sensors, and stereoscopic video
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM
Type 3 SoC:
  • DDR3L/L-RS single-channel memory controller supporting up to 2 GB
  • Display controller with 1 MIPI DSI port and 2 DDI ports
  • Integrated Intel HD Graphics GPU
  • One USB controller supporting two USB 2.0 ports
  • Integrated LPE audio controller
  • Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM

    Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Cherry Trail-T">Silvermont">Cherry Trail-T" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x2
  • Integrated Intel HD Graphics GPU
  • One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
  • One USB xDCI controller supporting one USB 3.0 port
  • Integrated LPE audio controller
  • Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM
Type 3 SoC:
  • DDR3L/L-RS single-channel memory controller supporting up to 2 GB
  • PCI Express 2.0 controller with 1 lane
  • Display controller with 2 MIPI DSI ports and 2 DDI ports
  • Integrated Intel HD Graphics GPU
  • One USB controller supporting three USB 2.0 ports and two HSIC ports
  • Integrated LPE audio controller
  • Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM

    Embedded">Embedded system">Embedded processors/SoC">System on a chip">SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Tunnel Creek">Tunnel Creek (microprocessor)">Tunnel Creek" (45 nm)

  • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, hyper-threading, Intel VT-x.
  • Package size: 22 mm × 22 mm
  • Steppings: B0
  • Temperature range: for : 0 °C to +70 °C, for : -40 °C to +85 °C.
  • DDR2 single-channel memory controller supporting up to 2 GB
  • PCI Express 1.0a controller with 4 lanes
  • Display controller with LVDS and serial DVO ports
  • Integrated GMA600 GPU
  • Integrated HD audio controller
  • Serial I/O supporting SPI