List of AMD processors with 3D graphics

Desktop processors with 3D graphics

APU or Radeon Graphics branded

Lynx: "Llano" (2011)

• Socket FM1
• CPU: K10 cores with an upgraded Stars architecture, no L3 cache
• * L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
• * L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
• * MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
• GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die. Sempron and Athlon models exclude integrated graphics.
• List of embedded GPU's
• Support for up to four DIMMs of up to DDR3-1866 memory
• Fabrication 32 nm on GlobalFoundries SOI process; Die size:, with 1.178 billion transistors
• 5 GT/s UMI
• Integrated PCIe 2.0 controller
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Virgo: "Trinity" (2012)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• CPU: Piledriver
• * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU TeraScale 3
• Die Size:, 1.303 Billion transistors
• Support for up to four DIMMs of up to DDR3-1866 memory
• 5 GT/s UMI
• GPU instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
• Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
• Sempron and Athlon models exclude integrated graphics
• Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance.

"Richland" (2013)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• Two or four CPU cores based on the Piledriver microarchitecture
• * Die Size:, 1.303 Billion transistors
• * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
• GPU
• * TeraScale 3 architecture
• * HD Media Accelerator, AMD Hybrid Graphics

"Kabini" (2013, SoC">System on a chip">SoC)

• Fabrication 28 nm by GlobalFoundries
• Socket AM1, aka Socket FS1b
• 2 to 4 CPU Cores
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III controllers
• GPU based on Graphics Core Next

"Kaveri" (2014) & "Godavari" (2015)

• Fabrication 28 nm by GlobalFoundries.
• Socket FM2+, support for PCIe 3.0.
• Two or four CPU cores based on the Steamroller microarchitecture.
• *Kaveri refresh models have codename Godavari.
• Die Size:, 2.41 Billion transistors.
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units based on GCN 2nd gen microarchitecture; 1 Compute Unit consists of 64 Unified Shader Processors : 4 Texture Mapping Units : 1 Render Output Unit.
• Heterogeneous System Architecture-enabled zero-copy through pointer passing.
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.
• Dual-channel DDR3 memory controller.
• Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions in select APU models, except the Performance APU models.
• Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.
• Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.

"Carrizo" (2016)

• Fabrication: 28 nm by GlobalFoundries
• Socket FM2+ or AM4, support for PCIe 3.0
• Two or four CPU cores based on the Excavator microarchitecture
• Die size:, 3.1 billion transistors
• L1 cache: 32 KB data per core and 96 KB instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Single- or dual-channel DDR3 or DDR4 memory controller
• Third generation GCN-based GPU
• Integrated custom ARM Cortex-A5 coprocessor with TrustZone security extensions

"Bristol Ridge" (2016)

• Fabrication 28 nm by GlobalFoundries
• Socket AM4, support for PCIe 3.0
• Two or four "Excavator+" CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• PCI Express 3.0 x8
• PCI Express 3.0 x4 as link to optional external chipset
• 4x USB 3.1 Gen 1
• Storage: 2x SATA and 2x NVMe or 2x PCI Express
• Third Generation GCN based GPU with hybrid VP9 decoding

"Raven Ridge" (2018)

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next 1.0

"Picasso" (2019)

• Fabrication 12 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next 1.0

"Renoir" (2020)

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 2 CPU cores
• Dual-channel DDR4 memory controller

"Cezanne" (2021)

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 3 CPU cores
• Dual-channel DDR4 memory controller

Non APU or Radeon Graphics branded

"Raphael" (2022)

• Fabrication 5 nm and 6 nm by TSMC
• Socket AM5
• Up to sixteen Zen 4 CPU cores
• Dual-channel DDR5 memory controller
• Basic iGPU

Server APUs

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)

• Fabrication 28 nm
• Socket FT3
• 4 CPU Cores
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Single-channel DDR3 memory controller
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on 2nd generation Graphics Core Next architecture

Opteron X3000-series "Toronto" (2017)

• Fabrication 28 nm
• Socket FP4
• Two or Four CPU cores based on the Excavator microarchitecture
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• Dual-channel DDR4 memory controller
• GPU based on 3rd generation Graphics Core Next architecture

Mobile processors with 3D graphics

APU or Radeon Graphics branded

Sabine: "Llano" (2011)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1
• Upgraded Stars codenamed Husky CPU cores with no L3 cache, and with Redwood-class integrated graphics on die
• L1 Cache: 64 KB Data per core and 64 KB Instructions per core
• Integrated PCIe 2.0 controller
• GPU: TeraScale 2
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
• 2.5 GT/s UMI
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!

Comal: "Trinity" (2012)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Based on the Piledriver architecture
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified
• 2.5 GT/s UMI
• Transistors: 1.303 billion
• Die size: 246 mm²

"Richland" (2013)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2Elite Performance APU.
• CPU: Piledriver architecture
• * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

"Kaveri" (2014)

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 CPU cores with 4 MB of L2 cache.
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units based on Graphics Core Next microarchitecture; 1 Compute Unit consists of 64 Unified Shader Processors : 4 Texture Mapping Units : 1 Render Output Unit
• AMD Heterogeneous System Architecture 2.0
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio
• Dual-channel DDR3 memory controller
• Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions

"Carrizo" (2015)

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2

"Bristol Ridge" (2016)

• Fabrication 28 nm
• Socket FP4
• Two or four "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2 with VP9 decoding

"Raven Ridge" (2017)

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Socket FP5
• Die size: 210 mm²
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Fifth generation GCN-based GPU

"Picasso" (2019)

• Fabrication 12 nm by GlobalFoundries
• Socket FP5
• Die size: 210 mm²
• Up to four Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN-based GPU

"Renoir" (2020)

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7 nm monolithic die
• Up to eight Zen 2 CPU cores
• L1 cache: 64 KB per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

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"Lucienne" (2021)

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7 nm monolithic die
• Up to eight Zen 2 CPU cores
• Fifth generation GCN-based GPU

"Cezanne" (2021)

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• L1 cache: 64 KB per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

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"Barceló" (2022)

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• L1 cache: 64 KB per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

"Rembrandt" (2022)

• Fabrication 6 nm by TSMC
• Socket FP7
• Die size: 210 mm²
• Up to eight Zen 3+ CPU cores
• Second generation RDNA-based GPU

"Phoenix" (2024)

• Fabrication 4 nm by TSMC
• Up to eight Zen 4 CPU cores
• Dual-channel DDR5 or LPDDR5x memory controller
• RDNA3 iGPU
• XDNA accelerator

"Dragon Range" (2023)

• Fabrication 5 nm and 6 nm by TSMC
• Up to sixteen Zen 4 CPU cores
• Dual-channel DDR5 memory controller
• Basic RDNA2 iGPU

Ultra-mobile APUs

Brazos: "Desna", "Ontario", "Zacate" (2011)

• Fabrication 40 nm by TSMC
• Socket FT1
• Based on the Bobcat microarchitecture
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics with UVD 3.0
• Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI

Brazos 2.0: "Ontario", "Zacate" (2012)

• Fabrication 40 nm by TSMC
• Socket FT1
• Based on the Bobcat microarchitecture
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI

Brazos-T: "Hondo" (2012)

• Fabrication 40 nm by TSMC
• Socket FT1
• Based on the Bobcat microarchitecture
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• Found in tablet computers
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• 2.50 GT/s UMI

"Kabini", "Temash" (2013)

• Fabrication 28 nm by TSMC
• Socket FT3
• 2 to 4 CPU Cores
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on Graphics Core Next
• AMD Eyefinity multi-monitor for up to two displays

"Beema", "Mullins" (2014)

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b
• CPU: 2 to 4
• * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

"Carrizo-L" (2015)

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b, FP4
• CPU: 2 to 4
• * L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
• All models except A8-7410 available in both laptop and all-in-one desktop versions

"Stoney Ridge" (2016)

• Fabrication 28 nm by GlobalFoundries
• Socket FP4 / FT4
• 2 "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• Single-channel DDR4 memory controller
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 3rd Generation with VP9 decoding

"Dalí" (2020)

• Fabrication 14 nm by GlobalFoundries
• Socket FP5
• Two Zen CPU cores
• Over 30% die size reduction over predecessor
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel RAM

"Pollock" (2020)

• Fabrication 14 nm by GlobalFoundries
• Socket FT5
• Two Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Single-channel RAM

Embedded APUs

G-Series

Brazos: "Ontario" and "Zacate" (2011)

• Fabrication 40 nm
• Socket FT1
• CPU microarchitecture: Bobcat
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
• Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
• 5 GT/s UMI

"Kabini" (2013, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FT3
• CPU microarchitecture: Jaguar
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module 1.2 support
• GPU microarchitecture: Graphics Core Next with Unified Video Decoder 3
• Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
• Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0

"Steppe Eagle" (2014, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FT3b
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

"Crowned Eagle" (2014, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FT3b
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• no GPU

LX-Family (2016, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FT3b
• 2 Puma x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• GPU microarchitecture: Graphics Core Next with support for DirectX 11.2
• Single channel 64-bit DDR3 memory with ECC
• Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

I-Family: "Brown Falcon" (2016, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FP4
• 2 or 4 Excavator x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• 4K × 2K H.265 decode capability and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

J-Family: "Prairie Falcon" (2016, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FP4
• 2 "Excavator+" x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Radeon R5E Graphics Core Next with support for DirectX 12
• Single channel 64-bit DDR4 or DDR3 memory
• 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

R-Series

Comal: "Trinity" (2012)

• Fabrication 32 nm
• Socket FP2, FS1r2
• CPU microarchitecture: Piledriver
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
• GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
• Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
• 2.5 GT/s UMI
• Die size: 246 mm²; Transistors: 1.303 billion
• OpenCL 1.1 and OpenGL 4.2 support

"Bald Eagle" (2014)

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 cores
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
• GPU microarchitecture: Graphics Core Next with support for DirectX 11.1 and OpenGL 4.2
• Dual channel DDR3 memory with ECC
• Unified Video Decode 4.2 and Video Coding Engine 2.0

"Merlin Falcon" (2015, SoC">System on a chip">SoC)

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• Unified Video Decode 6 and Video Coding Engine 3.1
• Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot
• Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

1000-Series

V1000-Family: "Great Horned Owl" (2018, SoC">System on a chip">SoC)

• Fabrication 14 nm by GlobalFoundries
• Up to 4 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

R1000-Family: "Banded Kestrel" (2019, SoC">System on a chip">SoC)

• Fabrication 14 nm by GlobalFoundries
• Up to 2 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

2000-Series

V2000-Family: "Grey Hawk" (2020, SoC">System on a chip">SoC)

• Fabrication 7 nm by TSMC
• Up to 8 Zen 2 cores
• Fifth generation GCN based GPU

R2000-Family: "River Hawk" (2022, SoC">System on a chip">SoC)

• Fabrication 12 nm by GlobalFoundries
• Up to 4 Zen+ cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core

Custom APUs