Intel Ivy Bridge–based Xeon microprocessors


Intel Ivy Bridge–based Xeon microprocessors is the follow-up to Sandy Bridge-E, using the same CPU core as the Ivy Bridge processor, but in LGA 2011, LGA 1356 and LGA 2011-1 packages for workstations and servers.
There are five different families of Xeon processors that were based on Sandy Bridge architecture:
  • Ivy Bridge-E uses LGA 2011 socket and was branded as Core i7 Extreme Edition and Core i7 high-end desktop processors, despite sharing many similarities with Xeon E5 models.
  • Ivy Bridge-EP which also uses LGA 2011 socket for the Xeon E5 models aimed at high-end servers and workstations. It supports up to 4 socket motherboards.
  • Ivy Bridge-EX introduces new LGA 2011-1 socket and features up to 15 cores. It supports up to eight socket motherboards.
  • Ivy Bridge-EN uses a smaller LGA 1356 socket for low-end and dual-processor servers on certain Xeon E5 and Pentium branded models.
  • Ivy Bridge Xeon with LGA 1155 socket were mostly identical to its desktop counterparts apart from the missing IGPU despite branded as Xeon processors.
  • Gladden was offered in BGA 1284 package for embedded applications.

    Features

  • Dual memory controllers for Ivy Bridge-EP and Ivy Bridge-EX
  • Up to 12 CPU cores and 30 MB of L3 cache for Ivy Bridge-EP
  • Up to 15 CPU cores and 37.5 MB L3 cache for Ivy Bridge-EX
  • Thermal design power between 50 W and 155 W
  • Support for up to eight DIMMs of DDR3-1866 memory per socket, with reductions in memory speed depending on the number of DIMMs per channel
  • No integrated GPU
  • Ivy Bridge-EP introduced new hardware support for interrupt virtualization, branded as APICv.

    Models and steppings

The basic Ivy Bridge-E is a single-socket processor sold as Core i7-49xx and is only available in the six-core S1 stepping, with some versions limited to four active cores.
There are in fact three die "flavors" for the Ivy Bridge-EP, meaning that they are manufactured and organized differently, according to the number of cores an Ivy Bridge-EP CPU includes:
  • The largest is an up-to-12-core die organized as three four-core columns with up to 30 MB L3 cache in two banks between the cores; these cores are linked by three rings of interconnects.
  • The intermediate is an up-to-10-core die organized as two five-core columns with up to 25 MB L3 cache in a single bank between the cores; the cores are linked by two rings of interconnects.
  • The smallest is an up-to-six-core die organized as two three-core columns with up to 15 MB L3 cache in a single bank between the cores; the cores are linked by two rings of interconnects.
Ivy Bridge-EX has up to 15 cores and scales to 8 sockets. The 15-core die is organized into three columns of five cores, with three interconnect rings connecting two columns per ring; each five-core column has a separate L3 cache.
Die code nameCPUIDSteppingDie sizeTransistorsCoresL3 cacheSocket
Ivy Bridge-E-60x0306ExS1256.5 mm21.86 billion615 MBLGA 2011
Ivy Bridge-EN-60x0306ExS1256.5 mm21.86 billion615 MBLGA 1356
Ivy Bridge-EP-60x0306ExS1256.5 mm21.86 billion615 MBLGA 2011
Ivy Bridge-EX-60x0306ExD1256.5 mm21.86 billion615 MBLGA 2011-1
Ivy Bridge-EN-100x0306ExM1341 mm22.89 billion1025 MBLGA 1356
Ivy Bridge-EP-100x0306ExM1341 mm22.89 billion1025 MBLGA 2011
Ivy Bridge-EX-100x0306ExD1341 mm22.89 billion1025 MBLGA 2011-1
Ivy Bridge-EP-120x0306ExC1541 mm24.31 billion1230 MBLGA 2011
Ivy Bridge-EX-150x0306ExD1541 mm24.31 billion1537.5 MBLGA 2011-1

Ivy Bridge-E and Ivy Bridge-EP

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
  • Support for up to 12 DIMMs of DDR3 memory per CPU socket.

    Ivy Bridge EX

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
  • Support for up to 24 DIMMs of DDR3 memory per CPU socket.

    Ivy Bridge EN

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
  • Support for up to six DIMMs of DDR3 memory per CPU socket.

    Ivy Bridge Xeon

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, ECC
  • Transistors: E1: 1.4 billion
  • Die size: E1: 160 mm²
  • All models support uni-processor configurations only.
  • Intel HD Graphics P4000 uses drivers that are optimized and certified for professional applications, similar to nVidia Quadro and AMD FirePro products.

    Gladden

  • All models support: MMX, Streaming SIMD Extensions, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Advanced Vector Extensions, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Trusted Execution Technology, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, AES-NI.
  • All models support uni-processor configurations only.
  • Die size:160 mm²
  • Steppings: E1