FeaturePak
The FeaturePak standard defines a small form factor card for I/O expansion of embedded systems and other space-constrained computing applications. The cards are intended to be used for adding a wide range of capabilities, such as A/D, D/A, digital I/O, counter/timers, serial I/O, wired or wireless networking, image processing, GPS, etc. to their host systems.
FeaturePak cards plug into edgecard sockets, parallel to the mainboard, similarly to how SO-DIMM memory modules install in laptop or desktop PCs.
Socket Interface
The FeaturePak socket consists of a 230-pin "MXM" connector, which provides all connections to the FeaturePak card, including the host interface, external I/O signals, and power.Host interface connections include:
- PCI Express -- up to two PCI Express x1 lanes
- USB -- up to two USB 1.1 or 2.0 channels
- Serial—one logic-level UART interface
- SMBus
- JTAG
- PCI Express Reset
- Several auxiliary signals
- 3V and 5V power and ground
- Reserved lines
- Primary I/O—50 general purpose I/O lines, of which 34 pairs have enhanced isolation
- Secondary I/O—50 general purpose I/O lines
FeaturePak cards are powered by 3.3V and use standard 3.3V logic levels. The socket also provides a 5V input option, for cards that require the additional voltage to power auxiliary functions.
Other than the provision of extra isolation for 34 signal pairs, there is no defined allocation of the signals within the Primary I/O and Secondary I/O groups, leaving each FeaturePak to define its own utilization of the I/O signals. Consequently, there is little limitation as to what can be implemented on a FeaturePak card.
Card size
Overall FeaturePak horizontal dimensions are 1.75 x 2.55 inches. There are two options for topside component thickness: "tall" FeaturePak modules may have topside components of up to 0.4 inch thick; "standard" modules are limited to 0.19 inch topside component thickness.History
The FeaturePak standard was launched by the FeaturePak Initiative at Embedded World 2010 in Nuremberg, Germany, in March 2010. At launch, the Initiative consisted of FeaturePak originator , plus FeaturePak Initiative charter members , , , , , , and .The FeaturePak Initiative subsequently was superseded by a California nonprofit corporation known as the FeaturePak Trade Association, which assumed ownership of the FeaturePak specification and other IP and became responsible for maintaining, extending, and promoting the FeaturePak standard and established restrictions and guidelines pertaining to the use of the FeaturePak trademark and logos.