Characterization of cyclic delamination behavior of thin film multilayers
Characterization of cyclic delamination behavior of thin film multilayers is a scholarly work, published in 2018 in ''Microelectronics Reliability''. The main subjects of the publication include microelectronics, composite material, bending, fracture mechanics, delamination (geology), adhesive, strain energy release rate, materials science, thin film, and -. The increasing number of thin film interfaces in modern microelectronic components makes determining fatigue delamination properties and understanding the underlying mechanisms a necessity to ensure the reliability of such devices.