List of AMD processors with 3D graphics

This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit, including those under the AMD APU product series.

WWW Official Site

Desktop processors with 3D graphics

APU or Radeon Graphics branded

Lynx: "Llano" (2011)

Socket FM1
CPU: K10 cores with an upgraded Stars architecture, no L3 cache
* L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
* L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
* MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die. Sempron and Athlon models exclude integrated graphics.
List of [AMD graphics processing units#IGP (HD 6000)|List of embedded GPU's]
Support for up to four DIMMs of up to DDR3-1866 memory
Fabrication 32 nm on GlobalFoundries SOI process; Die size:, with 1.178 billion transistors
5 GT/s UMI
Integrated PCIe 2.0 controller
Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Virgo: "Trinity" (2012)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FM2
CPU: Piledriver
* L1 Cache: 16 KB Data per core and 64 KB Instructions per module
GPU TeraScale 3
Die Size:, 1.303 Billion transistors
Support for up to four DIMMs of up to DDR3-1866 memory
5 GT/s UMI
GPU instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
Sempron and Athlon models exclude integrated graphics
Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance.

"Richland" (2013)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FM2
Two or four CPU cores based on the Piledriver microarchitecture
* Die Size:, 1.303 Billion transistors
* L1 Cache: 16 KB Data per core and 64 KB Instructions per module
* MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
GPU
* TeraScale 3 architecture
* HD Media Accelerator, AMD Hybrid Graphics

"Kabini" (2013, SoC">System on a chip">SoC)

Fabrication 28 nm by GlobalFoundries
Socket AM1, aka Socket FS1b
2 to 4 CPU Cores
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III controllers
GPU based on Graphics Core Next

"Kaveri" (2014) & "Godavari" (2015)

Fabrication 28 nm by GlobalFoundries.
Socket FM2+, support for PCIe 3.0.
Two or four CPU cores based on the Steamroller microarchitecture.
*Kaveri refresh models have codename Godavari.
Die Size:, 2.41 Billion transistors.
L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
Three to eight Compute Units based on GCN 2nd gen microarchitecture; 1 Compute Unit consists of 64 Unified Shader Processors : 4 Texture Mapping Units : 1 Render Output Unit.
Heterogeneous System Architecture-enabled zero-copy through pointer passing.
SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.
Dual-channel DDR3 memory controller.
Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions in select APU models, except the Performance APU models.
Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.
Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.

"Carrizo" (2016)

Fabrication: 28 nm by GlobalFoundries
Socket FM2+ or AM4, support for PCIe 3.0
Two or four CPU cores based on the Excavator microarchitecture
Die size:, 3.1 billion transistors
L1 cache: 32 KB data per core and 96 KB instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
Single- or dual-channel DDR3 or DDR4 memory controller
Third generation GCN-based GPU
Integrated custom ARM Cortex-A5 coprocessor with TrustZone security extensions

"Bristol Ridge" (2016)

Fabrication 28 nm by GlobalFoundries
Socket AM4, support for PCIe 3.0
Two or four "Excavator+" CPU cores
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
Dual-channel DDR4 memory controller
PCI Express 3.0 x8
PCI Express 3.0 x4 as link to optional external chipset
4x USB 3.1 Gen 1
Storage: 2x SATA and 2x NVMe or 2x PCI Express
Third Generation GCN based GPU with hybrid VP9 decoding

"Raven Ridge" (2018)

Fabrication 14 nm by GlobalFoundries
Transistors: 4.94 billion
Die size: 210 mm²
Socket AM4
Zen CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Dual-channel DDR4 memory controller
Fifth generation GCN based GPU
Video Core Next 1.0

"Picasso" (2019)

Fabrication 12 nm by GlobalFoundries
Transistors: 4.94 billion
Die size: 210 mm²
Socket AM4
Zen+ CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Dual-channel DDR4 memory controller
Fifth generation GCN based GPU
Video Core Next 1.0

"Renoir" (2020)

Fabrication 7 nm by TSMC
Socket AM4
Up to eight Zen 2 CPU cores
Dual-channel DDR4 memory controller

"Cezanne" (2021)

Fabrication 7 nm by TSMC
Socket AM4
Up to eight Zen 3 CPU cores
Dual-channel DDR4 memory controller

Non APU or Radeon Graphics branded

"Raphael" (2022)

Fabrication 5 nm and 6 nm by TSMC
Socket AM5
Up to sixteen Zen 4 CPU cores
Dual-channel DDR5 memory controller
Basic iGPU

Server APUs

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)

Fabrication 28 nm
Socket FT3
4 CPU Cores
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Single-channel DDR3 memory controller
Turbo Dock Technology, C6 and CC6 low power states
GPU based on 2nd generation Graphics Core Next architecture

Opteron X3000-series "Toronto" (2017)

Fabrication 28 nm
Socket FP4
Two or Four CPU cores based on the Excavator microarchitecture
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
Dual-channel DDR4 memory controller
GPU based on 3rd generation Graphics Core Next architecture

Mobile processors with 3D graphics

APU or Radeon Graphics branded

Sabine: "Llano" (2011)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FS1
Upgraded Stars codenamed Husky CPU cores with no L3 cache, and with Redwood-class integrated graphics on die
L1 Cache: 64 KB Data per core and 64 KB Instructions per core
Integrated PCIe 2.0 controller
GPU: TeraScale 2
Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
2.5 GT/s UMI
MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!

Comal: "Trinity" (2012)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FS1r2, FP2
Based on the Piledriver architecture
L1 Cache: 16 KB Data per core and 64 KB Instructions per module
GPU: TeraScale 3
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified
2.5 GT/s UMI
Transistors: 1.303 billion
Die size: 246 mm²

"Richland" (2013)

Fabrication 32 nm on GlobalFoundries SOI process
Socket FS1r2, FP2Elite Performance APU.
CPU: Piledriver architecture
* L1 Cache: 16 KB Data per core and 64 KB Instructions per module
GPU: TeraScale 3
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

"Kaveri" (2014)

Fabrication 28 nm
Socket FP3
Up to 4 Steamroller x86 CPU cores with 4 MB of L2 cache.
L1 Cache: 16 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
Three to eight Compute Units based on Graphics Core Next microarchitecture; 1 Compute Unit consists of 64 Unified Shader Processors : 4 Texture Mapping Units : 1 Render Output Unit
AMD Heterogeneous System Architecture 2.0
SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio
Dual-channel DDR3 memory controller
Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions

"Carrizo" (2015)

Fabrication 28 nm
Socket FP4
Up to 4 Excavator x86 CPU cores
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
GPU based on Graphics Core Next 1.2

"Bristol Ridge" (2016)

Fabrication 28 nm
Socket FP4
Two or four "Excavator+" x86 CPU cores
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
GPU based on Graphics Core Next 1.2 with VP9 decoding

"Raven Ridge" (2017)

Fabrication 14 nm by GlobalFoundries
Transistors: 4.94 billion
Socket FP5
Die size: 210 mm²
Zen CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Fifth generation GCN-based GPU

"Picasso" (2019)

Fabrication 12 nm by GlobalFoundries
Socket FP5
Die size: 210 mm²
Up to four Zen+ CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Dual-channel DDR4 memory controller
Fifth generation GCN-based GPU

"Renoir" (2020)

Fabrication 7 nm by TSMC
Socket FP6
Die size: 156 mm²
9.8 billion transistors on one single 7 nm monolithic die
Up to eight Zen 2 CPU cores
L1 cache: 64 KB per core.
L2 cache: 512 KB per core.
Fifth generation GCN-based GPU
Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
All the CPUs support 16 PCIe 3.0 lanes.
U

H

"Lucienne" (2021)

Fabrication 7 nm by TSMC
Socket FP6
Die size: 156 mm²
9.8 billion transistors on one single 7 nm monolithic die
Up to eight Zen 2 CPU cores
Fifth generation GCN-based GPU

"Cezanne" (2021)

Fabrication 7 nm by TSMC
Socket FP6
Die size: 180 mm²
Up to eight Zen 3 CPU cores
L1 cache: 64 KB per core.
L2 cache: 512 KB per core.
Fifth generation GCN-based GPU
Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
All the CPUs support 16 PCIe 3.0 lanes.
U

H

"Barceló" (2022)

Fabrication 7 nm by TSMC
Socket FP6
Die size: 180 mm²
Up to eight Zen 3 CPU cores
L1 cache: 64 KB per core.
L2 cache: 512 KB per core.
Fifth generation GCN-based GPU
Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
All the CPUs support 16 PCIe 3.0 lanes.

"Rembrandt" (2022)

Fabrication 6 nm by TSMC
Socket FP7
Die size: 210 mm²
Up to eight Zen 3+ CPU cores
Second generation RDNA-based GPU

"Phoenix" (2024)

Fabrication 4 nm by TSMC
Up to eight Zen 4 CPU cores
Dual-channel DDR5 or LPDDR5x memory controller
RDNA3 iGPU
XDNA accelerator

"Dragon Range" (2023)

Fabrication 5 nm and 6 nm by TSMC
Up to sixteen Zen 4 CPU cores
Dual-channel DDR5 memory controller
Basic RDNA2 iGPU

Ultra-mobile APUs

Brazos: "Desna", "Ontario", "Zacate" (2011)

Fabrication 40 nm by TSMC
Socket FT1
Based on the Bobcat microarchitecture
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!
DirectX 11 integrated graphics with UVD 3.0
Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
2.50 GT/s UMI

Brazos 2.0: "Ontario", "Zacate" (2012)

Fabrication 40 nm by TSMC
Socket FT1
Based on the Bobcat microarchitecture
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!
DirectX 11 integrated graphics
C-series denote Ontario; and the E-series denotes Zacate
2.50 GT/s UMI

Brazos-T: "Hondo" (2012)

Fabrication 40 nm by TSMC
Socket FT1
Based on the Bobcat microarchitecture
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
Found in tablet computers
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
PowerNow!
DirectX 11 integrated graphics
2.50 GT/s UMI

"Kabini", "Temash" (2013)

Fabrication 28 nm by TSMC
Socket FT3
2 to 4 CPU Cores
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Turbo Dock Technology, C6 and CC6 low power states
GPU based on Graphics Core Next
AMD Eyefinity multi-monitor for up to two displays

"Beema", "Mullins" (2014)

Fabrication 28 nm by GlobalFoundries
Socket FT3b
CPU: 2 to 4
* L1 Cache: 32 KB Data per core and 32 KB Instructions per core
GPU based on Graphics Core Next
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Intelligent Turbo Boost
Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

"Carrizo-L" (2015)

Fabrication 28 nm by GlobalFoundries
Socket FT3b, FP4
CPU: 2 to 4
* L1 Cache: 32 KB Data per core and 32 KB Instructions per core
GPU based on Graphics Core Next
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Intelligent Turbo Boost
Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
All models except A8-7410 available in both laptop and all-in-one desktop versions

"Stoney Ridge" (2016)

Fabrication 28 nm by GlobalFoundries
Socket FP4 / FT4
2 "Excavator+" x86 CPU cores
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
Single-channel DDR4 memory controller
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
GPU based on Graphics Core Next 3rd Generation with VP9 decoding

"Dalí" (2020)

Fabrication 14 nm by GlobalFoundries
Socket FP5
Two Zen CPU cores
Over 30% die size reduction over predecessor
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Dual-channel RAM

"Pollock" (2020)

Fabrication 14 nm by GlobalFoundries
Socket FT5
Two Zen CPU cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Single-channel RAM

Embedded APUs

G-Series

Brazos: "Ontario" and "Zacate" (2011)

Fabrication 40 nm
Socket FT1
CPU microarchitecture: Bobcat
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
5 GT/s UMI

"Kabini" (2013, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FT3
CPU microarchitecture: Jaguar
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module 1.2 support
GPU microarchitecture: Graphics Core Next with Unified Video Decoder 3
Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0

"Steppe Eagle" (2014, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FT3b
CPU microarchitecture: Puma
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

"Crowned Eagle" (2014, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FT3b
CPU microarchitecture: Puma
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
no GPU

LX-Family (2016, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FT3b
2 Puma x86 cores with 1MB shared L2 cache
L1 Cache: 32 KB Data per core and 32 KB Instructions per core
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
GPU microarchitecture: Graphics Core Next with support for DirectX 11.2
Single channel 64-bit DDR3 memory with ECC
Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

I-Family: "Brown Falcon" (2016, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FP4
2 or 4 Excavator x86 cores with 1MB shared L2 cache
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
GPU microarchitecture: Graphics Core Next with support for DirectX 12
Dual channel 64-bit DDR4 or DDR3 memory with ECC
4K × 2K H.265 decode capability and multi format encode and decode
Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

J-Family: "Prairie Falcon" (2016, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FP4
2 "Excavator+" x86 cores with 1MB shared L2 cache
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
GPU microarchitecture: Radeon R5E Graphics Core Next with support for DirectX 12
Single channel 64-bit DDR4 or DDR3 memory
4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

R-Series

Comal: "Trinity" (2012)

Fabrication 32 nm
Socket FP2, FS1r2
CPU microarchitecture: Piledriver
L1 Cache: 16 KB Data per core and 64 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
2.5 GT/s UMI
Die size: 246 mm²; Transistors: 1.303 billion
OpenCL 1.1 and OpenGL 4.2 support

"Bald Eagle" (2014)

Fabrication 28 nm
Socket FP3
Up to 4 Steamroller x86 cores
L1 Cache: 16 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
GPU microarchitecture: Graphics Core Next with support for DirectX 11.1 and OpenGL 4.2
Dual channel DDR3 memory with ECC
Unified Video Decode 4.2 and Video Coding Engine 2.0

"Merlin Falcon" (2015, SoC">System on a chip">SoC)

Fabrication 28 nm
Socket FP4
Up to 4 Excavator x86 cores
L1 Cache: 32 KB Data per core and 96 KB Instructions per module
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
GPU microarchitecture: Graphics Core Next with support for DirectX 12
Dual channel 64-bit DDR4 or DDR3 memory with ECC
Unified Video Decode 6 and Video Coding Engine 3.1
Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot
Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

1000-Series

V1000-Family: "Great Horned Owl" (2018, SoC">System on a chip">SoC)

Fabrication 14 nm by GlobalFoundries
Up to 4 Zen cores
Socket FP5
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Dual channel DDR4 memory with ECC
Fifth generation GCN based GPU

R1000-Family: "Banded Kestrel" (2019, SoC">System on a chip">SoC)

Fabrication 14 nm by GlobalFoundries
Up to 2 Zen cores
Socket FP5
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
Dual channel DDR4 memory with ECC
Fifth generation GCN based GPU

2000-Series

V2000-Family: "Grey Hawk" (2020, SoC">System on a chip">SoC)

Fabrication 7 nm by TSMC
Up to 8 Zen 2 cores
Fifth generation GCN based GPU

R2000-Family: "River Hawk" (2022, SoC">System on a chip">SoC)

Fabrication 12 nm by GlobalFoundries
Up to 4 Zen+ cores
MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core

Custom APUs

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit. Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One. So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.