List of AMD processors with 3D graphics


This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit, including those under the AMD APU product series.

Features overview

Graphics API overview

Desktop processors with 3D graphics

APU or Radeon Graphics branded

Lynx: "Llano" (2011)

  • Socket FM1
  • CPU: K10 cores with an upgraded Stars architecture, no L3 cache
  • * L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
  • * L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
  • * MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
  • GPU: TeraScale 2 ; all A and E series models feature Redwood-class integrated graphics on die. Sempron and Athlon models exclude integrated graphics.
  • List of embedded GPU's
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • Fabrication 32 nm on GlobalFoundries SOI process; Die size:, with 1.178 billion transistors
  • 5 GT/s UMI
  • Integrated PCIe 2.0 controller
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

    Virgo: "Trinity" (2012)

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FM2
  • CPU: Piledriver
  • * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • GPU TeraScale 3
  • Die Size:, 1.303 Billion transistors
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • 5 GT/s UMI
  • GPU instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
  • Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
  • Sempron and Athlon models exclude integrated graphics
  • Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance.

    "Richland" (2013)

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FM2
  • Two or four CPU cores based on the Piledriver microarchitecture
  • * Die Size:, 1.303 Billion transistors
  • * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • * MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
  • GPU
  • * TeraScale 3 architecture
  • * HD Media Accelerator, AMD Hybrid Graphics

    "Kabini" (2013, SoC">System on a chip">SoC)

  • Fabrication 28 nm by GlobalFoundries
  • Socket AM1, aka Socket FS1b
  • 2 to 4 CPU Cores
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III controllers
  • GPU based on Graphics Core Next

    "Kaveri" (2014) & "Godavari" (2015)

  • Fabrication 28 nm by GlobalFoundries.
  • Socket FM2+, support for PCIe 3.0.
  • Two or four CPU cores based on the Steamroller microarchitecture.
  • *Kaveri refresh models have codename Godavari.
  • Die Size:, 2.41 Billion transistors.
  • L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
  • Three to eight Compute Units based on GCN 2nd gen microarchitecture; 1 Compute Unit consists of 64 Unified Shader Processors : 4 Texture Mapping Units : 1 Render Output Unit.
  • Heterogeneous System Architecture-enabled zero-copy through pointer passing.
  • SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.
  • Dual-channel DDR3 memory controller.
  • Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions in select APU models, except the Performance APU models.
  • Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.
  • Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.

    "Carrizo" (2016)

  • Fabrication: 28 nm by GlobalFoundries
  • Socket FM2+ or AM4, support for PCIe 3.0
  • Two or four CPU cores based on the Excavator microarchitecture
  • Die size:, 3.1 billion transistors
  • L1 cache: 32 KB data per core and 96 KB instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • Single- or dual-channel DDR3 or DDR4 memory controller
  • Third generation GCN-based GPU
  • Integrated custom ARM Cortex-A5 coprocessor with TrustZone security extensions

    "Bristol Ridge" (2016)

  • Fabrication 28 nm by GlobalFoundries
  • Socket AM4, support for PCIe 3.0
  • Two or four "Excavator+" CPU cores
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • PCI Express 3.0 x8
  • PCI Express 3.0 x4 as link to optional external chipset
  • 4x USB 3.1 Gen 1
  • Storage: 2x SATA and 2x NVMe or 2x PCI Express
  • Third Generation GCN based GPU with hybrid VP9 decoding

    "Raven Ridge" (2018)

  • Fabrication 14 nm by GlobalFoundries
  • Transistors: 4.94 billion
  • Die size: 210 mm2
  • Socket AM4
  • Zen CPU cores
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • Fifth generation GCN based GPU
  • Video Core Next 1.0

    "Picasso" (2019)

  • Fabrication 12 nm by GlobalFoundries
  • Transistors: 4.94 billion
  • Die size: 210 mm2
  • Socket AM4
  • Zen+ CPU cores
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • Fifth generation GCN based GPU
  • Video Core Next 1.0

    "Renoir" (2020)

  • Fabrication 7 nm by TSMC
  • Socket AM4
  • Up to eight Zen 2 CPU cores
  • Dual-channel DDR4 memory controller

    "Cezanne" (2021)

  • Fabrication 7 nm by TSMC
  • Socket AM4
  • Up to eight Zen 3 CPU cores
  • Dual-channel DDR4 memory controller

    Non APU or Radeon Graphics branded

"Raphael" (2022)

  • Fabrication 5 nm and 6 nm by TSMC
  • Socket AM5
  • Up to sixteen Zen 4 CPU cores
  • Dual-channel DDR5 memory controller
  • Basic iGPU

    "Phoenix" (2024)

Server APUs

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)

  • Fabrication 28 nm
  • Socket FT3
  • 4 CPU Cores
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE, XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • Single-channel DDR3 memory controller
  • Turbo Dock Technology, C6 and CC6 low power states
  • GPU based on 2nd generation Graphics Core Next architecture

    Opteron X3000-series "Toronto" (2017)

  • Fabrication 28 nm
  • Socket FP4
  • Two or Four CPU cores based on the Excavator microarchitecture
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
  • Dual-channel DDR4 memory controller
  • GPU based on 3rd generation Graphics Core Next architecture

    Mobile processors with 3D graphics

APU or Radeon Graphics branded

Sabine: "Llano" (2011)

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1
  • Upgraded Stars codenamed Husky CPU cores with no L3 cache, and with Redwood-class integrated graphics on die
  • L1 Cache: 64 KB Data per core and 64 KB Instructions per core
  • Integrated PCIe 2.0 controller
  • GPU: TeraScale 2
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
  • 2.5 GT/s UMI
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!

    Comal: "Trinity" (2012)

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1r2, FP2
  • Based on the Piledriver architecture
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • GPU: TeraScale 3
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified
  • 2.5 GT/s UMI
  • Transistors: 1.303 billion
  • Die size: 246 mm2

    "Richland" (2013)

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1r2, FP2
  • Elite Performance APU.
  • CPU: Piledriver architecture
  • * L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • GPU: TeraScale 3
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core