Solder


Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Soft solder typically has a melting point range of, and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing.
In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point. Non-eutectic alloys can have markedly different solidus and liquidus temperatures, as they have distinct liquid and solid transitions. Non-eutectic mixtures often exist as a paste of solid particles in a melted matrix of the lower-melting phase as they approach high enough temperatures. In electrical work, if the joint is disturbed while in this "pasty" state before it fully solidifies, a poor electrical connection may result; use of eutectic solder reduces this problem. The pasty state of a non-eutectic solder can be exploited in plumbing, as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes, resulting in a so-called "wiped joint".
For electrical and electronics work, solder wire is available in a range of thicknesses for hand-soldering, and with cores containing flux. It is also available as a room temperature paste, as a preformed foil shaped to match the workpiece which may be more suited for mechanized mass-production, or in small "tabs" that can be wrapped around the joint and melted with a flame where an iron isn't usable or available, as for instance in field repairs. Alloys of lead and tin were commonly used in the past and are still available; they are particularly convenient for hand-soldering. Lead-free solders have been increasing in use due to regulatory requirements plus the health and environmental benefits of avoiding lead-based electronic components. They are almost exclusively used today in consumer electronics.
Solder wire diameters typically range from ultra-fine to heavy gauge. Each diameter suits particular soldering needs—ultra-fine wires provide precision for delicate electronics work such as micro soldering and surface-mount technology, fine wires offer versatility for general electronics and prototyping, medium wires are robust for general-purpose soldering and larger components, while heavy wires are ideal for plumbing, metalwork, and large electrical connections.
Plumbers often use bars of solder, much thicker than the wire used for electrical applications, and apply flux separately; many plumbing-suitable soldering fluxes are too corrosive to be used in electrical or electronic work. Jewelers often use solder in thin sheets, which they cut into snippets.

Etymology

The word solder comes from the Middle English word soudur, via Old French solduree and soulder, from the Latin solidare, meaning "to make solid".

Composition

Lead-based

-lead solders, also called soft solders, are commercially available with tin concentrations between 5% and 70% by weight. The greater the tin concentration, the greater the solder's tensile and shear strengths. Lead mitigates the formation of tin whiskers, though the precise mechanism for this is unknown. Today, many techniques are used to mitigate the problem, including changes to the annealing process, addition of elements like copper and nickel, and the application of conformal coatings. Alloys commonly used for electrical soldering are 60/40 Sn-Pb, which melts at, and 63/37 Sn-Pb used principally in electrical/electronic work. The latter mixture is a eutectic alloy of these metals, which:
  1. has the lowest melting point of all the tin-lead alloys; and
  2. the melting point is truly a point — not a range.
In the United States, since 1974, lead is prohibited in solder and flux in plumbing applications for drinking water use, per the Safe Drinking Water Act. Historically, a higher proportion of lead was used, commonly 50/50. This had the advantage of making the alloy solidify more slowly. With the pipes being physically fitted together before soldering, the solder could be wiped over the joint to ensure water tightness. Although lead water pipes were displaced by copper when the significance of lead poisoning began to be fully appreciated, lead solder was still used until the 1980s because it was thought that the amount of lead that could leach into water from the solder was negligible from a properly soldered joint. The electrochemical couple of copper and lead promotes corrosion of the lead and tin. Tin, however, is protected by insoluble oxide. Since even small amounts of lead have been found detrimental to health as a potent neurotoxin, lead in plumbing solder was replaced by silver or antimony, with copper often added, and the proportion of tin was increased.
The addition of tin—more expensive than lead—improves wetting properties of the alloy; lead itself has poor wetting characteristics. High-tin tin-lead alloys have limited use as the workability range can be provided by a cheaper high-lead alloy.
Lead-tin solders readily dissolve gold plating and form brittle intermetallics.
60/40 Sn-Pb solder oxidizes on the surface, forming a complex 4-layer structure: tin oxide on the surface, below it a layer of tin oxide with finely dispersed lead, followed by a layer of tin oxide with finely dispersed tin and lead, and the solder alloy itself underneath.
Lead, and to some degree tin, as used in solder contains small but significant amounts of radioisotope impurities. Radioisotopes undergoing alpha decay are a concern due to their tendency to cause soft errors. Polonium-210 is especially troublesome; lead-210 beta decays to bismuth-210 which then beta decays to polonium-210, an intense emitter of alpha particles. Uranium-238 and thorium-232 are other significant contaminants of alloys of lead.

Lead-free

The European Union Waste Electrical and Electronic Equipment Directive and Restriction of Hazardous Substances Directive were adopted in early 2003 and came into effect on July 1, 2006, restricting the inclusion of lead in most consumer electronics sold in the EU, and having a broad effect on consumer electronics sold worldwide. In the US, manufacturers may receive tax benefits by reducing the use of lead-based solder. Lead-free solders in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability.
When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable to reduce maintenance cost due to increased tin-scavenging of high-tin solder.
Tin-silver-copper solders are used by two-thirds of Japanese manufacturers for reflow and wave soldering, and by about 75% of companies for hand soldering. The widespread use of this popular lead-free solder alloy family is based on the reduced melting point of the Sn-Ag-Cu ternary eutectic behavior, which is below the 22/78 Sn-Ag eutectic of and the 99.3/0.7 Sn-Cu eutectic of. The ternary eutectic behavior of Sn-Ag-Cu and its application for electronics assembly was discovered by a team of researchers from Ames Laboratory, Iowa State University, and from Sandia National Laboratories-Albuquerque.
Much recent research has focused on the addition of a fourth element to Sn-Ag-Cu solder, in order to provide compatibility for the reduced cooling rate of solder sphere reflow for assembly of ball grid arrays. Examples of these four-element compositions are 18/64/14/4 tin-silver-copper-zinc and 18/64/16/2 tin-silver-copper-manganese.
Tin-based solders readily dissolve gold, forming brittle intermetallic joins; for Sn-Pb alloys the critical concentration of gold to embrittle the joint is about 4%. Indium-rich solders are more suitable for soldering thicker gold layers as the dissolution rate of gold in indium is much slower. Tin-rich solders also readily dissolve silver; for soldering silver metallization or surfaces, alloys with addition of silver are suitable; tin-free alloys are also a choice, though their wetting ability is poorer. If the soldering time is long enough to form the intermetallics, the tin surface of a joint soldered to gold is very dull.

Hard solder

Hard solders are used for brazing, and melt at higher temperatures. Alloys of copper with either zinc or silver are the most common.
In silversmithing or jewelry making, special hard solders are used that will pass assay. They contain a high proportion of the metal being soldered and lead is not used in these alloys. These solders vary in hardness, designated as "enameling", "hard", "medium", "easy" and "repair". Enameling solder has a high melting point, close to that of the material itself, to prevent the joint desoldering during firing in the enameling process. The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while additional sites are soldered. Easy solder or repair solder are also often used for repair work for the same reason. Flux is also used to prevent joints from desoldering.
Silver solder is also used in manufacturing to join metal parts that cannot be welded. The alloys used for these purposes contain a high proportion of silver, and may also contain cadmium.