KOMDIV-32
The KOMDIV-32 is a family of 32-bit microprocessors developed and manufactured by the Scientific [Research Institute of System Development] of the Russian Academy of Sciences. The manufacturing plant of NIISI is located in Dubna on the grounds of the Kurchatov Institute. The KOMDIV-32 processors are intended primarily for spacecraft applications and many of them are radiation hardened.
These microprocessors are compatible with MIPS R3000 and have an integrated MIPS R3010 compatible floating-point unit.
Overview
Details
1V812
- 0.5 μm CMOS process, 3-layer metal
- 108-pin ceramic quad flat package
- 1.5 million transistors, 8KB L1 instruction cache, 8KB L1 data cache, compatible with IDT 79R3081E
1890VM1T
- 0.5 μm CMOS process
1890VM2T
- 0.35 μm CMOS process
1990VM2T
- 0.35 μm silicon on insulator CMOS process
- 108-pin ceramic Quad Flat Package
- working temperature from -60 to 125 °C
5890VM1Т
- 0.5 μm silicon on insulator CMOS process
- 108-pin ceramic quad flat package
- cache
- working temperature from -60 to 125 °C
5890VE1Т
- 0.5 μm SOI CMOS process
- 240-pin ceramic QFP
- radiation tolerance to not less than 200 kRad, working temperature from -60 to 125 °C
- System-on-a-chip including PCI master / slave, 16 GPIO, 3 UART, 3 32-bit timers
- cache
- second-sourced by MVC Nizhny Novgorod under the name 1904VE1T with a clock rate of 40 MHz
1900VM2T
- development name Rezerv-32
- 0.35 μm SOI CMOS process
- 108-pin ceramic QFP
- radiation tolerance to not less than 200 kRad, working temperature from -60 to 125 °C
- triple modular redundancy on block level with self-healing
- both registers and cache are implemented as dual interlocked storage cells
1907VM014
- 0.25 μm SOI CMOS process; manufacturing to be moved to Mikron
- 256-pin ceramic QFP
- production planned for 2016
- radiation tolerance to not less than 200 kRad
- SoC including SpaceWire, GOST R 52070-2003, SPI, 32 GPIO, 2 UART, 3 timers, JTAG
- cache
1907VM038
- development name Skhema-10
- 0.25 μm SOI CMOS process; manufacturing to be moved to Mikron
- 675-pin ceramic Ball [grid array|BGA]
- SoC including SpaceWire, GOST R 52070-2003, RapidIO, SPI, I²C, 16 GPIO, 2 UART, 3 32-bit timers, JTAG, DSP
- DDR2 SDRAM controller with ECC
- cache
- working temperature from -60 to 125 °C
1907VM044
- development name Obrabotka-10
- 0.25 μm SOI CMOS process; manufactured by Mikron
- 256-pin ceramic QFP
- SoC including SpaceWire, GOST R 52070-2003, SPI, 32 GPIO, 2 UART, 3 timers, JTAG
- radiation tolerance to not less than 200 kRad
- triple modular redundancy in processor core
- both registers and cache are implemented as dual interlocked storage cells with 1 parity bit per byte for cache and Hamming code for registers
- SECDED for external memory
- working temperature from -60 to 125 °C
1907VM056
- development name Skhema-23
- 0.25 μm SOI CMOS process; manufactured by Mikron
- 407-pin ceramic PGA
- SoC including 8-channel SpaceWire, GOST R 52070-2003, SPI, I²C, CAN bus, 32 GPIO, 2 UART, 3 timers, JTAG
- cache
1907VM066
- development name Obrabotka-26
- 0.25 μm silicon on insulator CMOS process; manufactured by Mikron
- 407-pin ceramic PGA
- SoC including 4-channel SpaceWire, GOST R 52070-2003, SPI, I²C, RapidIO, GPIO, 2 UART, 3 timers, JTAG, PCI, co-processor for image processing
- cache
1907VK016
- development name Obrabotka-29
- 0.25 μm silicon on insulator CMOS process; manufactured by Mikron
- PGA
- SoC including 4-channel SpaceWire, GOST R 52070-2003, SPI, 32 GPIO, 2 UART, 3 timers, 128KB SRAM
- triple modular redundancy in processor core