COM-HPC


COM-HPC is a computer-on-module form factor standard that targets high performance compute and high I/O levels. Each COM-HPC module integrates core CPU and memory functionality and input and output including USB up to Gen 4, audio, graphics, up to Gen. 5, and Ethernet up to 25 Gbit/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.

History

The PICMG work-group officially started in October 23, 2018.
  • Rev. 1.00 Release date: Feb 19, 2021
  • Rev. 1.10 added HD Audio as alternative for SoundWire, functional safetey signals and a second 5V standby power pin. Release date: Jan 21, 2022
  • Rev. 1.20 added definition for the Mini. Release date: Oct. 3, 2023
  • Rev. 1.30 work started June 25, 2024. Major topics for the workgroup are:
  • *Signal integrity for PCIe Gen 6
  • *Modern Standby S0ix
  • *CXL

    Types

There are 3 different pin outs defined in the specification.
IO TypeClient PinoutServer PinoutMini Pinout
PCIe49 65 16
Ethernet2x NbaseT1x NbaseT2x NbaseT + 2x Serdes
25 Gigabit Ethernet KR280
USB4 424
USB 2.0888
DDI 302
eDP or MIPI DSI 101
MIPI SoundWire or DMIC202
I2S or MIPI SoundWire1 I2S 01 I2S
MIPI CSI-3 202 on flatfoil connector
SATA222 shared with PCIe
GPIO121212
UART222
IPMB110
eSPI 111
SPI 222
GP_SPI 111
I2C222
SMB111
DC Power Input8-20 Volt12 Volt +/- 5%8-20 Volt

Size

The specification defines 6 module sizes:
  • Size Mini:
The sizes A, B and C are typical Client Type sizes.
  • Size A:
  • Size B:
  • Size C:
The larger D and E sizes are typical Server Type sizes to support full size DRAM modules
  • Size D:
  • Size E:

    Specification

The COM-HPC specification is hosted by PICMG. It is not freely available but may be purchased from the PICMG website.
PICMG provides a preview version for free download.
The COM-HPC hardware specification will be released Jan 2021.
Further COM-HPC related documents will be released in 2021
  • Carrier Board Design Guide for Ethernet KR
  • Full Carrier Board Design Guide
  • Platform Management Specification
  • Embedded EEPROM Specification