List of Intel Atom processors


is Intel's line of low-power, low-cost and low-performance x86 and x86-64 microprocessors. Atom, with codenames of Silverthorne and Diamondville, was first announced on March 2, 2008.
For nettop and netbook Atom microprocessors after Diamondville, the memory and graphics controller are moved from the northbridge to the CPU. This explains the drastically increased transistor count for post-Diamondville Atom microprocessors.

[Nettop] processors (small desktop)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

"Cedarview">Cedarview (microprocessor)">Cedarview" (32 nm)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Diamondville">Diamondville (microprocessor)">Diamondville" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Transistors: 47 million
  • Die size: 26 mm2
  • Package size: 22 mm × 22 mm

    "Pineview">Pineview (microprocessor)#Pineview microprocessor">Pineview" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Integrated GMA 3150 GPU and DDR3/DDR2 single-channel memory controller supporting up to 2 GB
  • Transistors: 123 million, 176 million
  • Die size: 66 mm2 , 87 mm2
  • Package size: 22 mm × 22 mm

    Saltwell microarchitecture

"Cedarview">Cedarview (microprocessor)#Cedarview microprocessor">Cedarview" (32 nm)

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Silverthorne">Silverthorne (microprocessor)">Silverthorne" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading
  • Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support Intel VT-x
  • Model Z515 supports Intel Burst Performance Technology
  • Uses the Poulsbo chipset.
  • Transistors: 47 million
  • Die size: 26 mm2
  • Package size: 13 mm × 14 mm / 22 mm × 22 mm

    "Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
  • GMA 600 GPU and DDR2 single-channel memory controller are integrated into the processor.
  • Transistors: 140 million
  • Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
  • Package size: 13.8 mm × 13.8 × 1.0 mm
  • Steppings: C0

    Saltwell microarchitecture

"Penwell">Penwell (SoC)">Penwell" (32 nm)

"Merrifield">Silvermont">Merrifield" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology.
  • Z3480 also supports Intel Wireless Display.
  • Integrated PowerVR G6400 GPU, memory controller supporting two 32-bit LPDDR3 channels up to 4 GB, USB 3.0 controller, eMMC 4.5
  • Paired with Intel XMM 7160 LTE modem supporting 4G/3G/2G
  • Package size: 12 mm × 12 × 1.0 mm

    "Moorefield">Silvermont">Moorefield" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, Intel Burst Performance Technology, Intel Wireless Display.
  • GPU and memory controller are integrated onto the processor die
  • Package size: 14 mm × 14 × 1.0 mm

    "SoFIA">Rockchip#Tablet processors with integrated modem">SoFIA" (28 nm)

  • SoFIA
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel Burst Performance Technology, Intel VT-x, AES-NI
  • GPU and memory controller are integrated onto the processor die
  • Package size: 34 × 40 mm
  • SoFIA 3G SoC with Silvermont CPU
  • *Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
  • SoFIA 3G–R SoC with Silvermont CPU
  • *Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio
  • SoFIA LTE with Airmont CPU
  • *Integrated LTE Cat. 4, SMARTi 4.5, LnP/ CG2000, PMIC

    Tablet">Tablet computer#Intel tablet platforms">Tablet processors/SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Lincroft">Lincroft (microprocessor)">Lincroft" (45 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading. All except Z605 support Intel Burst Performance Technology.
  • GMA 600 GPU and DDR2 single-channel memory controller are integrated onto the processor die
  • Transistors: 140 million
  • Die size: 7.34 mm × 8.89 mm = 65.2526 mm2
  • Package size: 13.8 mm × 13.8 × 1.0 mm
  • Steppings: C0

    Saltwell microarchitecture

"Cloverview">Cloverview (SoC)">Cloverview" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, XD bit, Hyper-Threading, Intel Burst Performance Technology.
  • GPU and memory controller are integrated onto the processor die
  • Package size: 13.8 mm × 13.8 × 1.0 mm
  • Steppings:B1, C0
No official TDP available. For power data see page 129–130.

Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-T">Silvermont">Bay Trail-T" (22 nm)

Type 4 SoC:
Type 3 SoC:
  • DDR3L/L-RS single-channel memory controller supporting up to 2 GB
  • Display controller with 1 MIPI DSI port and 2 DDI ports
  • Integrated Intel HD Graphics (Gen7) GPU
  • One USB controller supporting two USB 2.0 ports
  • Integrated LPE audio controller
  • Integrated image signal processor supporting two MIPI CSI ports and 8 MP sensors
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM

    Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Cherry Trail-T">Silvermont">Cherry Trail-T" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x2
  • Integrated Intel HD Graphics (Gen8) GPU
  • One USB xHCI controller supporting three USB 3.0 ports, two SSCI ports, and two HSIC ports
  • One USB xDCI controller supporting one USB 3.0 port
  • Integrated LPE audio controller
  • Integrated image signal processor supporting three MIPI CSI ports and 13 MP ZLS sensors
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM
Type 3 SoC:
  • DDR3L/L-RS single-channel memory controller supporting up to 2 GB
  • PCI Express 2.0 controller with 1 lane
  • Display controller with 2 MIPI DSI ports and 2 DDI ports
  • Integrated Intel HD Graphics (Gen8) GPU
  • One USB controller supporting three USB 2.0 ports and two HSIC ports
  • Integrated LPE audio controller
  • Integrated image signal processor supporting three MIPI CSI ports and 8 MP sensors
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.51, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM

    Embedded">Embedded system">Embedded processors/SoC">System on a chip">SoCs

Bonnell microarchitecture">Bonnell (microarchitecture)">Bonnell microarchitecture

"Tunnel Creek">Tunnel Creek (microprocessor)">Tunnel Creek" (45 nm)

  • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, hyper-threading, Intel VT-x.
  • Package size: 22 mm × 22 mm
  • Steppings: B0
  • Temperature range: for : 0 °C to +70 °C, for : -40 °C to +85 °C.
  • DDR2 single-channel memory controller supporting up to 2 GB
  • PCI Express 1.0a controller with 4 lanes
  • Display controller with LVDS and serial DVO ports
  • Integrated GMA600 GPU
  • Integrated HD audio controller
  • Serial I/O supporting SPI

    "Stellarton">Stellarton (microprocessor)">Stellarton" (45 nm)

  • "Tunnel Creek" CPU with an Altera Field Programmable Gate Array
  • CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Hyper-Threading, Intel VT-x
  • Package size: 37.5 mm × 37.5 mm
  • Steppings: B0
  • TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
  • Temperature range: for : 0 °C to +70 °C, for : -40 °C to +85 °C.
  • DDR2 single-channel memory controller supporting up to 2 GB
  • PCI Express 1.0a controller with 4 lanes
  • Display controller with LVDS and serial DVO ports
  • Integrated GMA600 GPU
  • Integrated HD audio controller
  • Serial I/O supporting SPI

    Silvermont microarchitecture">Silvermont">Silvermont microarchitecture

"Bay Trail-I">Silvermont">Bay Trail-I" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, AES-NI, TXT/TXE
  • Package size: 25 mm × 27 mm
  • DDR3L dual-channel memory controller supporting up to 4 GB; ECC supported in single-channel mode
  • Display controller with 2 DDI ports
  • Integrated Intel HD Graphics (Gen7) GPU
  • PCI Express 2.0 controller with four lanes and four root ports
  • Two SATA-300 ports
  • One USB 3.0 controller supporting one USB 3.0 port
  • One USB 2.0 controller supporting four ports
  • Integrated LPE and HD audio controllers
  • Integrated image signal processor supporting three MIPI CSI ports, 24 MP sensors, and stereoscopic video
  • Integrated memory card reader supporting SDIO 3.0, eMMC 4.5, and SDXC
  • Serial I/O supporting SPI, UART, I2C or PWM

    Airmont microarchitecture">Silvermont">Airmont microarchitecture

"Braswell">Silvermont">Braswell" (14 nm)

"Apollo Lake">Goldmont">Apollo Lake" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, Intel VT-d, AES-NI, TXT/TXE
  • Package size: 24 mm × 31 mm
  • DDR3L/LPDDR3/LPDDR4 dual-channel memory controller supporting up to 8 GB; support for DDR3L with ECC
  • Display controller with 1 MIPI DSI port and 2 DDI ports
  • Integrated Intel HD Graphics (Gen9) GPU
  • PCI Express 2.0 controller supporting 6 lanes ; 4 lanes available externally
  • Two USB 3.0 ports
  • Two USB 2.0 ports
  • Two SATA-600 ports
  • Integrated HD audio controller
  • Integrated image signal processor supporting four MIPI CSI ports and 13 MP sensors
  • Integrated memory card reader supporting SDIO 3.01 and eMMC 5.0
  • Serial I/O supporting SPI, HSUART and I2C

    Tremont microarchitecture">Tremont (microarchitecture)">Tremont microarchitecture

"Elkhart Lake">Tremont (microarchitecture)">Elkhart Lake" (10 nm)

"Amston Lake" (7 nm)

In Q2 2024 Intel launched these cpus: Atom® x7203C, Atom® x7211RE, Atom® x7213RE, Atom® x7405C, Atom® x7433RE, Atom® x7809C, Atom® x7835RE. These processors have 2-8 cpu cores and use 6-25 watts of power.

Server">Server (computing)">Server SoCs

All Atom server processors include ECC support.

Saltwell microarchitecture">Bonnell (microarchitecture)">Saltwell microarchitecture

"Centerton">Centerton (SoC)">Centerton" (32 nm)

"Avoton">Silvermont">Avoton" (22 nm)

"Denverton">Goldmont">Denverton" (14 nm)

"Snow Ridge">Tremont (microarchitecture)">Snow Ridge" (10 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
  • Same frequency for all models: 2.2 GHz. L2 cache: 4.5 MB per module; each module comprises four CPU cores.
  • SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express, in x16, x8, and x4 configurations.
  • Intel Dynamic Load Balancer & Intel QuickAssist Technology
  • P####B models are designed for base transceiver stations, especially that for 5G networks. All other models are designed for communications.
  • Package size: 47.5 mm × 47.5 mm

    "Parker Ridge">Tremont (microarchitecture)">Parker Ridge" (10 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Intel 64, XD bit, Intel VT-x, AES-NI, ECC memory.
  • SoC peripherals include 4 × USB 3.0, 4 × USB 2.0, 16 × SATA, Integrated Intel Ethernet 800 series 100 Gbit/s LAN, 3 × UART, and up to 32 lanes of PCI Express, in x16, x8, and x4 configurations.
  • Intel Dynamic Load Balancer & Intel QuickAssist Technology
  • Model numbers ending in 0 are extended temperature range; model numbers ending in 5 are commercial temperature range.
  • Package size: 47.5 mm × 47.5 mm

    CE">Intel Consumer Electronics">CE SoCs

Single-core CE SoCs

"Sodaville">Sodaville (SoC)">Sodaville" (45 nm)

  • Package size: 27 mm × 27 mm
  • GPU

    "Groveland">Groveland (SoC)">Groveland" (45 nm)

CE4200
  • Package size: ?? mm × ?? mm
  • 2 × 32-bit memory channels, up to DDR2-800
  • GPU

    Dual-Core CE SoCs

"Berryville">Berryville (SoC)">Berryville" (32 nm)

  • Package size: ?? mm × ?? mm
  • GPU for 3D
  • GPU for 2D